- Epitaxial planar die construction
- Surface device type mounting
- Moisture sensitivity level 1
- Matte Tin(Sn) lead finish with Nickel(Ni) underplat
- Packing code with suffix "G" means
green compound (halogen-free)
- Case: SOT- 23, molded plastic
- Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260
o
C/10s
- Weight: 0.008g (approximately)
- Marking Code: D3Q
SYMBOL UNIT
P
D
mW
V
RRM
V
V
R
V
I
O
mA
I
FSM
A
T
J
, T
STG
o
C
SYMBOL UNIT
Reverse Breakdown Voltage
V
(BR)
V
I
R
μA
Junction Capacitance
C
J
pF
Note 1: Mean output current per element : I
O
/2
Document Number: DS_S1409009 Version: G14
V
R
=0V, f=1.0MHz
-50
-0.55
Reverse Leakage Current
V
R
=25V
-70
Forward Voltage
I
F
=10mA
V
F
-0.32
V
I
F
=200mA
Junction and Storage Temperature Range -40 to +125
PARAMETER MIN MAX
I
R
=100μA
40 -
Mean Forward Current 350
Non-Repetitive Peak Forward Surge Current (Note 1) 1.5
200
Repetitive Peak Reverse Voltage 40
Reverse Voltage 25
PARAMETER VALUE
Power Dissipation
MECHANICAL DATA
SOT-23
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (T
A
=25℃ unless otherwise noted)
RB495D
Taiwan Semiconductor
Small Signal Product
SMD Schottky Diode
FEATURES
