MAX2395
WCDMA Quasi-Direct Modulator
with VGA and PA Driver
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It is recommended that the exposed pad be soldered
to a ground plane on the PCB, either directly or through
an array of plated via holes. Soldering the pad to
ground is critical for proper heat dissipation. Use a
solid ground plane wherever possible. Any cutout in the
ground plane may act as a slot radiator and reduce its
shield effectiveness.
SDATA
SCLK
BIT 4BIT 14 BIT 15 A0A1BIT 5
t
CWH
t
CWL
t
CH
t
CS
t
ES
CS
Figure 1. 3-Wire SPI/MICROWIRE Serial-Interface Timing Diagram
Figure 2. Register Assignments
MSB
20-BIT REGISTER
LSB
DATA 16 BITS ADDRESS 4 BITS
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 A3 A2 A1 A0
RFM DIVIDE RATIO REGISTER (16 BITS) ADDRESS
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 0
010
RFR DIVIDE RATIO REGISTER (9 BITS) ADDRESS
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 0 0 0
OPERATION CONTROL REGISTER (16 BITS) ADDRESS
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 0 1 0 0
0