NB3N3001DTG

NB3N3001
http://onsemi.com
7
PC Board Layout Example
Figure 11 shows a representative board layout for the
NB3N3001. There exists many different potential board
layouts and the one pictured is but one. The crystal X1
footprint shown in this example allows installation of either
surface mount HC49S or throughhole HC49 package. The
footprints of other components in this example are listed in
Table 11. There should be at least one decoupling capacitor
per power pin. The decoupling capacitors should be located
as close as possible to the power pins. The layout assumes
that the board has clean analog power ground plane. The
important aspect of the layout in Figure 11 is the low
impedance connections between V
CC and GND for the
bypass capacitors. Combining good quality general purpose
chip capacitors with good PCB layout techniques will
produce effective capacitor resonances at frequencies
adequate to supply the instantaneous switching current for
the NB3N3001 outputs. It is imperative that low inductance
chip capacitors are used. It is equally important that the
board layout not introduce any of the inductance saved by
using the leadless capacitors. Thin interconnect traces
between the capacitor and the power plane should be
avoided and multiple large vias should be used to tie the
capacitors to the buried power planes. Fat interconnect and
large vias will help to minimize layout induced inductance
and thus maximize the series resonant point of the bypass
capacitors.
The voltage amplitude across the crystal is relatively
small. It is imperative that no actively switching signals
cross under the crystal as crosstalk energy coupled to these
lines could significantly impact the jitter of the device.
Table 11. Footprint Table
Reference Size
C1, C2 0402
C3 0805
C4, C5 0603
R2 0603
Figure 11. PC Board Layout
C2
C1
Figure 12. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50
Z
o
= 50
50 50
V
TT
V
TT
= V
CC
2.0 V
ORDERING INFORMATION
Device Package Shipping
NB3N3001DTG TSSOP8 4.4 mm
(PbFree)
100 Units / Rail
NB3N3001DTR2G TSSOP8 4.4 mm
(PbFree)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NB3N3001
http://onsemi.com
8
PACKAGE DIMENSIONS
TSSOP8
CASE 948S01
ISSUE C
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 4.30 4.50 0.169 0.177
C --- 1.10 --- 0.043
D 0.05 0.15 0.002 0.006
F 0.50 0.70 0.020 0.028
G 0.65 BSC 0.026 BSC
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
____
SEATING
PLANE
PIN 1
1
4
85
DETAIL E
B
C
D
A
G
L
2X L/2
U
S
U0.20 (0.008) T
S
U
M
0.10 (0.004) V
S
T
0.076 (0.003)
T
V
W
8x REFK
IDENT
K 0.19 0.30 0.007 0.012
S
U0.20 (0.008) T
DETAIL E
F
M
0.25 (0.010)
K1
K
JJ1
SECTION NN
J 0.09 0.20 0.004 0.008
K1 0.19 0.25 0.007 0.010
J1 0.09 0.16 0.004 0.006
N
N
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
NB3N3001/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative

NB3N3001DTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC CLK GEN LVPECL DIFF 8-TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet