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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-3311EN - May 31, 2012
Re ow Pro le Recommendations
Typical SMT Re ow Pro le for Maximum Temperature = 260 +0/-5° C
Pro le Feature Sn-Pb Solder Pb-Free Solder
Average ramp-up rate (TL to TP) 3°C/sec max 3°C/sec max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
100° C
150° C
60-120 sec
150° C
200° C
60-120 sec
Tsmax to TL
– Ramp-up Rate 3°C/sec max
Time maintained above:
– Temperature (TL)
– Time (TL)
183° C
60-150 sec
217° C
60-150 sec
Peak temperature (Tp) 240 +0/-5° C 260 +0/-5° C
Time within 5° C of actual Peak Temperature (tp) 10-30 sec 20-40 sec
Ramp-down Rate 6°C/sec max 6°C/sec max
Time 25° C to Peak Temperature 6 min max. 8 min max.
25
Time
Temperature
T
p
T
L
t
p
t
L
t 25° C to Peak
Ramp-up
t
s
T
smin
Ramp-down
Preheat
Critical Zone
T
L
to T
p
T
smax
