RT8204A
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Find a low pass inductor having the lowest possible DC
resistance that fits in the allowed dimensions. Ferrite cores
are often the best choice, although powdered iron is
inexpensive and can work well at 200kHz. The core must
be large enough and not to saturate at the peak inductor
current (I
PEAK
) :
I
PEAK
= I
LOAD(MAX)
+ [(L
IR
/ 2) x I
LOAD(MAX)
]
Output Capacitor Selection
The output filter capacitor must have ESR low enough to
meet output ripple and load transient requirement, yet have
high enough ESR to satisfy stability requirements. Also,
the capacitance value must be high enough to absorb the
inductor energy going from a full-load to no-load condition
without tripping the OVP circuit.
For CPU core voltage converters and other applications
where the output is subject to violent load transient, the
output capacitor's size depends on how much ESR is
needed to prevent the output from dipping too low under a
load transient. Ignoring the sag due to finite capacitance :
P-P
LOAD(MAX)
V
ESR
I
In non-CPU applications, the output capacitor's size
depends on how much ESR is needed to maintain at an
acceptable level of output voltage ripple :
P-P
IR LOAD(MAX)
V
ESR
LI
×
SW
ESR
OUT
f
1
f =
2 ESR C 4
π
×× ×
Organic semiconductor capacitors or specially polymer
capacitors are recommended.
Output Capacitor Stability
Stability is determined by the value of the ESR zero relative
to the switching frequency. The point of instability is given
by the following equation :
Do not put high-value ceramic capacitors directly across
the outputs without taking precautions to ensure stability.
Large ceramic capacitors can have a high ESR zero
frequency and cause erratic and unstable operation.
However, it is easy to add sufficient series resistance by
placing the capacitors a couple of inches downstream from
the inductor and connecting V
OUT
or FB divider close to
the inductor.
There are two related but distinct ways including double-
pulsing and feedback loop instability to identify the
unstable operation.
Double-pulsing occurs due to noise on the output or
because the ESR is too low that there is not enough
voltage ramp in the output voltage signal. The fools the
error comparator into triggering a new cycle immediately
after 400ns minimum off-time period has expired. Double-
pulsing is more annoying than harmful, resulting in nothing
worse than increased output ripple. However, it may
indicate the possible presence of loop instability, which
is caused by insufficient ESR.
Loop instability can result in oscillation at the output after
line or load perturbations that can trip the over voltage
protection latch or cause the output voltage to fall below
the tolerance limit.
The easiest method for stability checking is to apply a
very zero-to-max load transient and carefully observe the
output-voltage-ripple envelope for overshoot and ringing. It
helps to simultaneously monitor the inductor current with
AC probe. Do not allow more than one ringing cycle after
the initial step-response under- or over-shoot.
LDO Normal Operation
The RT8204A LDO controls an N-MOSFET to produce a
tightly regulated output voltage from higher supply voltage.
It takes 5V power supply for controller and draws maximally
400μA while operating.
The feedback voltage is regulated to compare with the
internal 0.75V reference voltage. To set the output voltage,
feedback the conjunction of a resistor voltage divider from
output node to ground for the LFB pin.
Depending upon the input voltage used for the device, the
LDRV pin can be pulled up near to VDD. Thus the device
can be used to regulate a large range of output voltage by
careful selection of the external MOSFETs.
A built-in active high enable control (LEN pin) is used to
turn the RT8204A LDO on. If this pin is pulled low, the
LDRV pin is pulled low, turning off the N-MOSFET. If this
pin is pulled higher than 2V, the LDRV pin is enabled.
RT8204A
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The RT8204A LDO contains a power good output pin
(LPGOOD pin) which is an open drain output that will be
pulled low if the output is below the power good threshold
(typically 90% of the programmed output voltage, or 93%
at the start up). The power good detection is active if the
RT8204A LDO is enabled.
The RT8204A LDO also includes a under voltage protection
circuit that monitors the output voltage. If the output voltage
drops below 50% (typical) of the nominal value, as would
occur during over current or short condition, the RT8204A
LDO will pull the LDRV pin low and latch off. The RT8204A
LDO is latched once the UVP is triggered and can only
be relieved by the VDD or LEN power-on reset.
LDO Driver and Stability Design
The drive output (LDRV pin) is sink/source capable. The
sink current is typically 2mA while the source current is
typically 2mA in normal operation.
The drive output is also used for stabilizing the loop of the
system using different type of the output capacitor. The
components listed in the table below should be used.
Table 1. LDO Configuration and Compensation
LDO Configuration
Compensator
Input
Voltage
Output
Voltage
C7 C8 R11
1.25V 1.05V 33nF 39pF 82Ω
1.5V 1.05V 33nF 47pF 43Ω
1.5V 1.25V 33nF 47pF 30Ω
1.8V 1.5V 33nF 39pF 100Ω
Note: test condition is output capacitor 220μF(ESR : 9
to 25mΩ) or 100μF(ESR : 9 to 15mΩ) + MLCC
10μFoutput current is from 0.1A to 5A
LDO Output Under Voltage Protection(UVP)
The RT8204A LDO has output under voltage protection
that looks at the output to see if it is :
(a) The LDO output voltage is less than 50% (typical) of
its nominal value and
(b) The V
DRV
is within 900mV (typical) of its maximum.
This provides inherent immunity to under voltage shut down
at start up since V
DRV
has a slow rate of rising at this
moment. If both of these criteria are met, the output will
be shut down by means of the V
DRV
pulled to ground
immediately.
If the VDDP input is coming prior to the LDO_VIN, it could
accidentally meet the UVP fault protection. To avoid
entering UVP latch off, using enable control (LEN pin) to
turn the system on whenever all power supplies are ready.
Please see the power sequencing example as below
(Figure 7).
Figure 7. Power Supply Sequencing
LDO Output Voltage Setting
The LFB pin connects directly to the inverting input of the
error amplifier, and the output voltage is set using external
resistor R3 and R4 (Figure 8). The following equation is
for adjusting the output voltage.
OUT LFB
R3
V = V 1
R4
⎡⎤
⎛⎞
×+
⎜⎟
⎢⎥
⎝⎠
⎣⎦
where V
LFB
is 0.75V (typ.).
RT8204A Supply Comes Up Before MOSFET Drain Supply
VDDP
LDO_VIN
LEN
VTH(UV) = 0.88V
VTH(LEN) occurs after VTH(UV)
is reached
VTH(LEN) = 2V
MOSFET Drain Supply Comes Up Before RT8204A Supply
LEN
VDDP
VTH(UV) = 0.88V
LDO_VIN
VTH(LEN) = 2V
VTH(LEN) occurs after VTH(UV) is
reached LEN rising with VDDP shown
RT8204A
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DS8204A-05 April 2011www.richtek.com
LDRV
LFB
LDO_VIN
LDO_VOUT
R3
R4
Figure 8. LDO Output Voltage Setting
LDO Output Capacitor Selection
Low ESR capacitors such as Sanyo POSCAPs or
Panasonic SP-caps are recommended for bulk
capacitance, and ceramic bypass capacitors are
recommended for decoupling high frequency transients.
LDO Input Capacitor Selection
Low ESR capacitors such as Sanyo POSCAPs or
Panasonic SP-caps are recommended for the input
capacitors to provide better load transient response. If the
LDO input is connected from the output of buck converter
(V
OUT1
), a 0.1μF ceramic capacitor will sufficient.
LDO MOSFET Selection
Low threshold N-MOSFETs are required. For the device
to work under all operating conditions, a maximum R
DS(ON)
must be met to ensure that the output will not go into
dropout :
IN(MIN) OUT(MAX)
DS(ON)(MAX)
OUT(PEAK)
VV
R =
I
Ω
Layout Considerations
Layout is very important in high frequency switching
converter design. If the Layout is designed improperly,
the PCB could radiate excessive noise and contribute to
the converter instability. Certain points must be considered
before starting a layout for the RT8204A.
` Connect an RC low pass filter from VDDP to VDD, 1μF
and 10Ω are recommended. Place the filter capacitor
close to the IC.
` Keep current limit setting network as close as possible
to the IC. Routing of the network should avoid coupling
to high voltage switching node.
` Connections from the drivers to the respective gate of
the high side or the low side MOSFET should be as
short as possible to reduce stray inductance.
` All sensitive analog traces and components such as
VOUT, FB, GND, EN/DEM, PGOOD, OC, VDD, and
TON should be placed away from high voltage switching
nodes such as PHASE, LGATE, UGATE, or BOOT
nodes to avoid coupling. Use internal layers as ground
planes and shield the feedback trace from power traces
and components.
` Current sense connections must always be made using
Kelvin connections to ensure an accurate signal, with
the current limit resistor located at the device.
` Power sections should connect directly to ground planes
using multiple vias as required for current handling
(including the chip power ground connections). Power
components should be placed to minimize loops and
reduce losses.
Note that R
DS(ON)
must be met for operating temperature
range at the minimum V
GS
condition.
Power consumptions of the N-MOSFETs should be taken
into consideration for the selection of various package
types.

RT8204AGQW

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Description:
IC REG DL BCK/LINEAR SYNC 16WQFN
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