OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

CPC1967J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
DS-CPC1967-R08 www.ixysic.com 1
e
3
Characteristics
Features
• 3.35A
rms
Load Current with 5°C/W Heat Sink
• Low 0.85 On-Resistance
• 400V
P
Blocking Voltage
• 2500V
rms
Input/Output Isolation
• Low Thermal Resistance:
JC
= 0.35 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Recognized Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high power Solid
State Relays.
As part of this family, the CPC1967 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.35A
rms
continuous load current with a
5°C/W heat sink.
The CPC1967 employs optically coupled MOSFET
technology to provide 2500V
rms
of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V
rms
isolation,
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Switching Characteristics
Parameter Rating Units
Blocking Voltage 400
V
P
Load Current, T
A
=25°C:
With 5°C/W Heat Sink 3.35
A
rms
/ A
DC
No Heat Sink 1.35
On-Resistance (max) 0.85
Thermal Resistance,
Junction-to-Case,
JC
0.35 °C/W
Part Description
CPC1967J i4-PAC Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
CPC1967
400V Single-Pole, Normally Open
Power Relay
I
NTEGRATED
C
IRCUITS
D
IVISION
R08 www.ixysic.com 2
CPC1967
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
1
Higher load currents possible with proper heat sinking.
2
Measurement taken within 1 second of on-time.
3
For applications requiring high temperature operation (T
C
> 60ºC) an LED drive current of 20mA is recommended.
Symbol Ratings Units
Blocking Voltage 400
V
P
Reverse Input Voltage 5
V
Input Control Current 100
mA
Peak (10ms) 1
A
Input Power Dissipation 150
mW
Isolation Voltage, Input to Output 2500 V
rms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125
°C
Parameter Conditions Symbol Minimum Typical Maximum Units
Output Characteristics
Load Current
1
Peak t10ms
--
15
A
P
Continuous No Heat Sink
I
L
1.35
Continuous
T
C
=25°C
13.15
A
rms
/ A
DC
Continuous
T
C
=99°C
I
L(99)
1.5
On-Resistance
2
I
F
=10mA, I
L
=1A
R
ON
- 0.7 0.85
Off-State Leakage Current
V
L
=400V
P
I
LEAK
--1 A
Switching Speeds
Tu r n - O n
I
F
=10mA, V
L
=10V
t
on
-520
ms
Tu r n - O f f t
off
-0.135
Output Capacitance
V
L
=25V, f=1MHz
C
out
-470- pF
Input Characteristics
Input Control Current to Activate
3
I
L
=1A
I
F
--10 mA
Input Control Current to Deactivate - I
F
0.6 - - mA
Input Voltage Drop
I
F
=5mA
V
F
0.9 1.2 1.4 V
Reverse Input Current
V
R
=5V
I
R
--10 A
Input/Output Characteristics
Capacitance, Input-to-Output -
C
I/O
-1- pF
I
NTEGRATED
C
IRCUITS
D
IVISION
3 www.ixysic.com R08
CPC1967
2 Thermal Characteristics
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Parameter Conditions Symbol Rating Units
Thermal Resistance (Junction to Case) -
JC
0.35 °C/W
Thermal Resistance (Junction to Ambient) Free Air
JA
33 °C/W
Junction Temperature (Operating) -
T
J
-40 to +100 °C
θ
CA
=
- θ
JC
(T
J
- T
A
) I
L(99)
2
I
L
2
• P
D(99)
T
J
= Junction Temperature (°C), T
J
≤ 100°C *
T
A
= Ambient Temperature (°C)
I
L(99)
= Load Current with Case Temperature @ 99°C (A
DC
)
I
L
= Desired Operating Load Current (A
DC
), I
L
≤ I
L(MAX)
θ
JC
= Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θ
CA
= Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D(99)
= Maximum power dissipation with case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
Heat Sink Rating
P1-P3P4-P6P7-P7

CPC1967J

Mfr. #:
Buy CPC1967J
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount 400V Single Pole 400V Power Relay
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet