VSC7414XKT-01

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2× SGMII

SI

Copper

LAN

PCIe

VSC7414

SparX-III

11-Port Switch

VSC7414

SparX-III

SPI Flash

CPU

Highlights

• Best-in-class power and small footprint

11-port SGMII switch

• All ports provide direct connectivity to

1 Gbps and 100 Mbps optical modules

supporting industrial temperature range

• Audio Video Bridging (AVB) with support for

time-synchronized, low-latency audio video

• Industrial switching

• Audio Video Bridging (AVB)

Microsemi’s newest member of the SparX-III switch family delivers a

low-power solution for Enterprise routing, industrial switching solutions,

and Audio Video Bridging (AVB).

VSC7414 contains nine 10/100/1000 Mbps SGMII/SerDes ports

and two 1G/2.5G SGMII/SerDes ports. All ports support both

100BASE-FX and 1000BASE-X SerDes. VSC7414 provides a rich

set of Ethernet switching features such as Layer-2 forwarding with

advanced TCAM-based VLAN and QoS processing enabling delivery of

VSC7414 includes an embedded 416 MHz MIPS processor 32-bit CPU

with DDR2/DDR3 external memory.

A comprehensive application programming interface (API) and software

package are provided. The software package integrates easily with

third-party software, preserving existing software investments while

adding new, enhanced functionality.

VSC7414

and service marks are the property of their respective owners.

Layer 2 Switching

• IEEE 802.1Q VLAN switch with 8K MACs and 4K VLANs

• Exceptional low power consumption

• Fully nonblocking wire-speed switching performance for all

• Jumbo frame support

• Wire-speed hardware-based learning and CPU-based learning

confi gurable per port

QoS Features

• Policing with storm control and MC/BC protection

• Advanced security and prioritization available through a multi-

stage TCAM engine

• More than 8 QoS queues per port with strict or defi cit-weighted

round robin scheduling

• QoS classifi cation based on IEEE 802.1p and IPv4/IPv6 DSCP

• L1 Synchronous Ethernet

VeriTime™ Features

• L2 IEEE 1588v2

• Boundary clock and transparent clock

Key Specifi cations

• 24 mm × 24 mm thermally enhanced TQFP package

• 1.6 W typical power dissipation

• Operating temperature –40 °C to 125 °C

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