NCP6324, NCV6324
www.onsemi.com
15
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511BE
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
L
D2
E2
C
C0.10
C0.10
C0.08
A1
SEATING
PLANE
8X
NOTE 3
b
8X
0.10 C
0.05 C
A
BB
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
b 0.20 0.30
D 2.00 BSC
D2 1.50 1.70
E 2.00 BSC
E2 0.80 1.00
e 0.50 BSC
L 0.20 0.40
1
4
8
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
PITCH
1.00
2.30
1
DIMENSIONS: MILLIMETERS
0.50
8X
NOTE 4
0.30
8X
DETAIL A
A3 0.20 REF
A3
A
DETAIL B
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
L1 −−− 0.15
OUTLINE
PACKAGE
e
RECOMMENDED
K 0.25 REF
5
1.70
K
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