Data Sheet ADG1421/ADG1422/ADG1423
Rev. A | Page 13 of 16
V
OUT
50
NETWORK
ANALYZER
R
L
50
IN
V
IN
S
D
50
OFF ISOLATION = 20 LOG
V
OUT
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
08487-027
Figure 29. Off Isolation
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
V
OUT
GND
S1
D
S2
V
OUT
NETWORK
ANALYZER
R
L
50
R
50
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
08487-028
Figure 30. Channel-to-Channel Crosstalk
V
OUT
50
NETWORK
ANALYZER
R
L
50
IN
V
IN
S
D
INSERTION LOSS = 20 LOG
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
08487-029
Figure 31. Bandwidth
V
OUT
R
S
AUDIO PRECISION
R
L
10k
IN
V
IN
S
D
V
S
V p-p
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
08487-030
Figure 32. THD + N
ADG1421/ADG1422/ADG1423 Data Sheet
TERMINOLOGY
I
DD
The positive supply current.
I
SS
The negative supply current.
V
D
(V
S
)
The analog voltage on Terminal D and Terminal S.
R
ON
The ohmic resistance between Terminal D and Terminal S.
R
FLAT (ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
I
S
(Off)
The source leakage current with the switch off.
I
D
(Off)
The drain leakage current with the switch off.
I
D
, I
S
(On)
The channel leakage current with the switch on.
V
INL
The maximum input voltage for Logic 0.
V
INH
The minimum input voltage for Logic 1.
I
INL
(I
INH
)
The input current of the digital input.
C
S
(Off)
The off switch source capacitance, measured with reference to
ground.
C
D
(Off)
The off switch drain capacitance, measured with reference to
ground.
C
D
, C
S
(On)
The on switch capacitance, measured with reference to ground.
C
IN
The digital input capacitance.
t
ON
(EN)
Delay time between the 50% and 90% points of the digital input
and switch on condition. See Figure 26.
t
OFF
(EN)
Delay time between the 50% and 90% points of the digital input
and switch off condition. See Figure 26.
t
TRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
T
BBM
Off time measured between the 80% point of both switches
when switching from one address state to another. See Figure 27.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching. See Figure 28.
Off Isolation
A measure of unwanted signal coupling through an off switch.
See Figure 29.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance. See
Figure 30.
Bandwidth
The frequency at which the output is attenuated by 3 dB. See
Figure 31.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch. See Figure 31.
THD + N
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental. See Figure 32.
AC Power Supply Rejection Ratio (ACPSRR)
ACPSRR measures the ability of a part to avoid coupling noise
and spurious signals that appear on the supply voltage pin to the
output of the switch. The dc voltage on the device is modulated
by a sine wave of 0.62 V p-p. The ratio of the amplitude of signal on
the output to the amplitude of the modulation is the ACPSRR.
See Figure 22.
Rev. A | Page 14 of 16
Data Sheet ADG1421/ADG1422/ADG1423
Rev. A | Page 15 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-BA
091709-A
0.70
0.55
0.40
5
10
1
6
0.50 BSC
0.30
0.15
1.10 MAX
3.10
3.00
2.90
COPLANARITY
0.10
0.23
0.13
3.10
3.00
2.90
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 33. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
2.48
2.38
2.23
0.50
0.40
0.30
10
1
6
5
0.30
0.25
0.20
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.74
1.64
1.49
0.20 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
COPLANARITY
0.08
02-05-2013-C
TOP VIEW
BOTTOM VIEW
0.20 MIN
*FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS SECTION
OF THIS DATA SHEET.
Figure 34. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters

ADG1421BRMZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog Switch ICs IC 64dB 2.1 Ohm iCMOS Dual SPST
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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