AOWF8N50

AOWF8N50
500V, 8A N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 8A
R
DS(ON)
(at V
GS
=10V) < 0.85
100% UIS Tested
100% R
g
Tested
The AOWF8N50 has been fabricated using an advanced
high voltage MOSFET process that is designed to deliver
high levels of performance and robustness in popular AC-
DC applications.
By providing low R
DS(on)
, C
iss
and C
rss
along with
guaranteed avalanche capability this part can be adopted
quickly into new and existing offline power supply
designs.
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
600V@150
Top View
TO-262F
Bottom View
G
D
S
G
D
S
AOWF8N50
G
D
S
Symbol
V
DS
V
GS
I
DM
I
AR
E
AR
E
AS
Peak diode recovery dv/dt dv/dt
T
J
, T
STG
T
L
Symbol
R
JA
R
θJC
* Drain current limited by maximum junction temperature.
Maximum Junction-to-Case
mJ
°C/W
Derate above 25
o
C
Parameter
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
A,D
Power Dissipation
B
T
C
=25°C
Thermal Characteristics
5
27.8
-55 to 150
300
W
V±30Gate-Source Voltage
T
C
=100°C
P
D
A
W/
o
C
mJ
V/ns
V
UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
Drain-Source Voltage 500
AOWF8N50
A
30Pulsed Drain Current
C
Continuous Drain
Current
T
C
=25°C
I
D
8*
6*
Avalanche Current
C
154
Single plused avalanche energy
G
307
3.2
Repetitive avalanche energy
C
AOWF8N50
65
4.5
0.22
Units
°C/W
°C
°C
Top View
TO-262F
Bottom View
G
D
S
G
D
S
AOWF8N50
G
D
S
Rev0: Dec 2011
www.aosmd.com Page 1 of 5
AOWF8N50
Symbol Min Typ Max Units
500
600
BV
DSS
/
TJ
0.56
V/
o
C
1
10
I
GSS
Gate-Body leakage current
±100
nΑ
V
GS(th)
Gate Threshold Voltage
3.4 4 4.5 V
R
DS(ON)
0.63 0.85
g
FS
10 S
V
SD
0.73 1 V
I
S
Maximum Body-Diode Continuous Current 8 A
I
SM
30 A
C
iss
694 868 1042 pF
C
oss
65 93 121 pF
C
rss
4.5 7.8 11 pF
R
g
2 4 6
Q
g
18 23.6 28 nC
Q
gs
4 5.2 6.2 nC
Q
gd
5.2 10.6 16 nC
t
D(on)
19.5 ns
t
r
47 ns
t
D(off)
51.5 ns
V
DS
=40V, I
D
=4A
Forward Transconductance
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
V
DS
=5V
I
D
=250µA
V
DS
=400V, T
J
=125°C
Zero Gate Voltage Drain Current
I
DSS
Zero Gate Voltage Drain Current
V
DS
=500V, V
GS
=0V
ID=250µA, VGS=0V
BV
DSS
Static Drain-Source On-Resistance
V
GS
=10V, I
D
=4A
Reverse Transfer Capacitance
V
GS
=0V, V
DS
=25V, f=1MHz
Diode Forward Voltage
Turn-Off DelayTime
V
GS
=10V, V
DS
=250V, I
D
=8A,
R
G
=25
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Total Gate Charge
V
GS
=10V, V
DS
=400V, I
D
=8A
Gate Source Charge
Gate Drain Charge
SWITCHING PARAMETERS
I
S
=1A,V
GS
=0V
Maximum Body-Diode Pulsed Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
µA
V
DS
=0V, V
GS
30V
V
Drain-Source Breakdown Voltage
I
D
=250µA, V
GS
=0V, T
J
=25°C
I
D
=250µA, V
GS
=0V, T
J
=150°C
t
D(off)
51.5
ns
t
f
38.5 ns
t
rr
160 206 247
ns
Q
rr
1.7 2.1 2.6
µC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
I
F
=8A,dI/dt=100A/µs,V
DS
=100V
Turn-Off DelayTime
G
Turn-Off Fall Time
Body Diode Reverse Recovery Charge
I
F
=8A,dI/dt=100A/µs,V
DS
=100V
Body Diode Reverse Recovery Time
A. The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C, Ratings are based on low frequency and duty cycles to keep initial
T
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, I
AS
=3.2A, V
DD
=150V, R
G
=25, Starting T
J
=25°C
Rev0: Dec 2011 www.aosmd.com Page 2 of 5
AOWF8N50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
2
4
6
8
10
12
14
16
0 5 10 15 20 25 30
I
D
(A)
V
DS
(Volts)
Fig 1: On-Region Characteristics
V
GS
=5.5V
6V
10V
6.5V
0.1
1
10
100
2 4 6 8 10
I
D
(A)
V
GS
(Volts)
Figure 2: Transfer Characteristics
-
55
°
C
V
DS
=40V
25°C
125
°
C
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 2 4 6 8 10 12 14 16 18
R
DS(ON)
(
)
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Normalized On-Resistance
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
V
GS
=10V
I
D
=4A
40
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0
I
S
(A)
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
25°C
125°C
0
2
4
6
8
10
12
14
16
0 5 10 15 20 25 30
I
D
(A)
V
DS
(Volts)
Fig 1: On-Region Characteristics
V
GS
=5.5V
6V
10V
6.5V
0.1
1
10
100
2 4 6 8 10
I
D
(A)
V
GS
(Volts)
Figure 2: Transfer Characteristics
-
55
°
C
V
DS
=40V
25°C
125
°
C
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 2 4 6 8 10 12 14 16 18
R
DS(ON)
(
)
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Normalized On-Resistance
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
V
GS
=10V
I
D
=4A
0.8
0.9
1
1.1
1.2
-100 -50 0 50 100 150 200
BV
DSS
(Normalized)
T
J
C)
Figure 5:Break Down vs. Junction Temparature
Rev0: Dec 2011 www.aosmd.com Page 3 of 5

AOWF8N50

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 500V 8A TO262F
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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