ISL96017
3
FN8243.2
June 8, 2012
Absolute Maximum Ratings Thermal Information
Storage Temperature: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to 150°C
Note: All Voltages with Respect to GND
Voltage at SCL, SDA, WP
: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 4V
Voltage at RH, RW, RL: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to VDD
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 4V
Lead Temperature (Soldering, 10s): . . . . . . . . . . . . . . . . . . . . . . . . . .300°C
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
ESD (MIL-STD-883B, Method 3014). . . . . . . . . . . . . . . . . . . . . . . . . .>2000V
ESD (Machine Model). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >150V
Thermal Resistance (Typical)
JA
(°C/W)
JC
(°C/W)
8 Ld TDFN Package (Notes 3, 4). . . . . . . . . 52 5
Moisture Sensitivity (see Technical Brief TB363
). . . . . . . . . .Level 2
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . . . 150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
VDD Voltage for DCP Operation . . . . . . . . . . . . . . . . . . . . . . . . . 3.0V to 3.6V
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -3mA to 3mA
Power Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mW
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTE:
3.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379
for details.
4. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Over recommended operating conditions unless otherwise stated. All voltages with respect to GND. Boldface
limits apply over the operating temperature range, -40°C to +85°C.
SYMBOL PARAMETER TEST CONDITIONS
MIN
(Note 18)
TYP
(Note 5)
MAX
(Note 18) UNIT
IccdSby Standby Current at VDD Serial interface in standby 10 µA
IccdRd Read Current at VDD Reading with 400kHz at SCL 1 mA
IccdWr Write Current at VDD Writing to EEPROM 5 mA
I
LkgDig
Leakage Current at Pins SDA, SCL, and WP Pin voltage from GND to VDD -10 10 µA
I
LkgDCP
Leakage Current at RH, RW, RL Pin voltage from GND to VDD -1 1 µA
VDDRamp VDD Power-Up Ramp Rate 0.2 V/ms
t
DCP
(Note 17)
DCP Wiper Response Time SCL falling edge of last bit of DCP Data Byte to
wiper change
1.5 µs
t
D
Power-Up Delay VDD above 2.6V, to DCP Initial Value Register
recall completed, and I
2
C Interface in standby
state
3 ms
CH/CW/CL
(Note 17)
RH, RW, RL Pin Capacitance 10 pF
R
Total
Total Resistance W and U versions, respectively. T
A
= 25°C.
Measured between R
H
and R
L
pins.
10, 50 k
R
Total
Tolerance T
A
= 25°C. Measured between R
H
and R
L
pins.
-20 20 %
R
Wiper
Wiper Resistance V
DD
= 3.3V @ 25°C. Wiper current =
V
DD
/R
Total
100 300
DCP Resolution 7 Bits
DCP IN VOLTAGE DIVIDER MODE (0V at RL, VCC at RH; measured at RW unloaded)
FSerror
(Note 6, 7)
Full-Scale Error U option -2 -1 0 LSB
W option -5 -1 0 LSB
ZSerror
(Note 6, 8)
Zero-Scale Error U option 0 1 2 LSB
W option 0 1 5 LSB
