www.sensirion.com Version 1.9 – July 2015 8/10
8. Instructions for Use
8.1 Soldering instructions
Standard wave soldering systems may be used for
soldering SDP600 series sensors. Reflow soldering is not
feasible and may damage the sensor.
The sensor ports must be protected from solder splash
and flux during soldering. Figure 6 shows an appropriate
temperature profile with maximum temperature values.
Figure 6: Suitable wave soldering profile.
The characteristics of wave soldering machines vary, so
any soldering setup must be tested before production use.
8.2 Sensor handling
The sensors of the SDP600 series are designed to be
robust and vibration resistant. Nevertheless, the accuracy
of the high-precision SDP600 series can be degraded by
rough handling. Sensirion does not guarantee proper
operation in case of improper handling. Note: avoid
applying any mechanical stress to the solder joints of the
sensor during or as a result of PCB assembly.
The sensor ships in an antistatic package to prevent
electrostatic discharge (ESD), which can damage the part.
To avoid such damage, ground yourself using a grounding
strap or by touching a grounded object. Furthermore store
the parts in the antistatic package when not in use.
8.3 Additional attachment
If necessary, the robustness of the sensor attachment to
the PCB can be increased by using a bracket as shown in
Figure 7.
Sensirion recommends using this additional bracket when
the sensor is fitted to a PCB. The bracket must be secured
before the pins are soldered to the PCB, as otherwise
sensor performance may be degraded by mechanical
stress.
Figure 7: Supplementary bracket for the SDP600 series.
8.4 Air flow and tubing
Due to the dynamic measurement principle, a small air
flow is required.
Figure 8: Typical air flow through the SDP600 series sensor.
Note: 1 sccm = 1 cm3/min at 0°C and 1013 mbar
(1 sccm = 0.001 standard liter).
This air flow through the sensor creates a dependence on
the tube length. The error is less than 1% with a tube
length up to 1 m (with 3/16 inch inside diameter).
Solder Wave Peak
Temp. max. 260°C
Approx. PCB
bottom-side temp.
