- Low power loss, high current capability, low VF
- Surface device type mounting
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with
Nickel (Ni) under plate
- Pb free version and RoHS compliant
- Packing code with suffix "G" means
green compound (halogen-free)
- Case: SOT- 23, molded plastic
- Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260°C/10s
- Weight: 8 mg (approximately)
- Marking Code: JV
SYMBOL UNIT
P
D
mW
V
RRM
V
I
O
mA
I
FSM
mA
R
θJA
°C/W
T
J
, T
STG
°C
SYMBOL UNIT
V
BR
V
C
J
pF
t
rr
ns
Notes : 1. Valid provided that electrodes are kept at ambient temperature
Document Number: DS_S1412037 Version: D15
Thermal Resistance (Junction to Ambient) (Note 1)
Non-Repetitive Peak Forward Surge Current @ t = 1.0 s
Mean Forward Current
Repetitive Peak Reverse Voltage
Power Dissipation
-55 to +150
330
500
200
75
-
2. Reverse recovery test conditions : I
F
=10mA , I
R
=10mA , R
L
=100 Ω, I
RR
= 1mA
3.0Reverse Recovery Time (Note 2)
-2.0
V
75
MIN
Junction and Storage Temperature Range
PARAMETER MAX
-Reverse Breakdown Voltage
I
R
= 100 μA
225
-
-1.0
0.9
V
F
-
-1.25
1.1
Junction Capacitance
Forward Voltage
I
F
= 150 mA
I
F
= 50 mA
I
F
= 10 mA
I
F
= 1 mA
V
R
= 0 V , f = 1.0 MHz
Reverse Leakage Current
PARAMETER VALUE
SOT-23
MECHANICAL DATA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
BAS116
Taiwan Semiconductor
Small Signal Product
225mW, SMD Switching Diode
FEATURES
nA
V
R
= 75 V
T
J
=25°C
T
J
=150°C
I
R
-
80
5
