Tflex
TM
HD300 Series
Thermal Gap Filler
Americas: +1.866.928.8181
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
Product Description
Laird Tflex
TM
HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products.
Tflex
TM
HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can
be filled with Tflex
TM
HD300 while generating minimal board and component stress. Laird’s unique
manufacturing capabilities, and filler and resin knowledge result in this unique product designed with
customer applications in mind.
Tflex
TM
HD300 material exhibits excellent surface wetting characteristics and high deflection
properties ensuring low contact resistances and providing an overall lower total thermal resistance.
Tflex
TM
HD300 is provided in thickness from 0.5mm (.020”) up to 5mm (.200”) in 0.5mm (.020”)
increments as standard. In addition, Laird can provide Tflex
TM
HD300 in multiple converted formats
through approved converters and distribution networks.
FEATURES AND BENEFITS
• 2.7 W/m K thermal conductivity
• Low pressure versus deflection characteristics
• Excellent surface wetting for low contact resistance
• Minimizes board and component stress.
• Large tolerance applications
• RoHS and REACH compliant
SPECIFICATIONS
TYPICAL PROPERTIES VALUE TEST METHOD
Construction & Composition Ceramic filled silicone sheet N/A
Color Pink Visual
Thickness Range 0.50mm (0.020”) 5.0mm (0.20”) N/A
Thermal Conductivity (W/mK) 2.7 ASTM D5470
Density (g/cc) 3.1 Helium Pycnometer
Hardness (Shore 00) 38 ASTM D2240
Outgassing TML (weight %) 0.39 ASTM E595
Outgassing CVCM (weight %) 0.10 ASTM E595
Temperature Range -40°C to 200°C Laird Test Method
Rth@ 40 mils, 10 psi 0.573°C–in2/W ASTM D5470 (Modified)
Dielectric Constant @ 1 MHz 6.62 ASTM D150
UL Flammability Rating V-0 UL-94
Volume Resistivity 1.2x 10
14
ASTM D257