2011-07-11
Rev 2.6 Page 2
BSS 84 P
Thermal Characteristics
Parameter
Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - soldering point
(Pin 3)
R
thJS
- - 200 K/W
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
R
thJA
-
-
-
-
350
300
Electrical Characteristics, at T
A
= 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
V
GS
=0, I
D
=-250µA
V
(BR)DSS
-60 - - V
Gate threshold voltage, V
GS
= V
DS
I
D
=-20µA
V
GS(th)
-1 -1.5 -2
Zero gate voltage drain current
V
DS
=-60V, V
GS
=0, T
A
=25°C
V
DS
=-60V, V
GS
=0, T
A
=125°C
I
DSS
-
-
-0.1
-10
-1
-100
µA
Gate-source leakage current
V
GS
=-20V, V
DS
=0
I
GSS
- -10 -100 nA
Drain-source on-state resistance
V
GS
=-4.5V, I
D
=-0.14A
R
DS(on)
- 8 12
Drain-source on-state resistance
V
GS
=-10V, I
D
=-0.17A
R
DS(on)
- 5.8 8
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
