15
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FN8113.2
June 30, 2008
X4003, X4005
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums and to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
L
0.25
(0.010)
L1
R1
R
4X
4X
GAUGE
PLANE
SEATING
PLANE
EE1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008) A
B
C
SEATING
PLANE
0.20 (0.008) C
0.10 (0.004) C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008) C
D
E
1
C
L
C
a
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.037 0.043 0.94 1.10 -
A1 0.002 0.006 0.05 0.15 -
A2 0.030 0.037 0.75 0.95 -
b 0.010 0.014 0.25 0.36 9
c 0.004 0.008 0.09 0.20 -
D 0.116 0.120 2.95 3.05 3
E1 0.116 0.120 2.95 3.05 4
e 0.026 BSC 0.65 BSC -
E 0.187 0.199 4.75 5.05 -
L 0.016 0.028 0.40 0.70 6
L1 0.037 REF 0.95 REF -
N8 87
R 0.003 - 0.07 - -
R1 0.003 - 0.07 - -
05
o
15
o
5
o
15
o
-
0
o
6
o
0
o
6
o
-
Rev. 2 01/03
