Technical Note
10/14
www.rohm.com
2010.05 - Rev.
A
© 2010 ROHM Co., Ltd. All rights reserved.
BD3506F,BD3506EFV
Recommended Circuits
Part No Value Notes for use
R1/R2 6.5k/5.5k
The present IC can set output voltage by external reference voltage (VR) and value of output voltage
setting resistors (R1, R2). Output voltage can be set by VRxR2/(R1+R2) but it is recommended to
use at the resistance value (total: about 10 k) which is not susceptible to VREF bias current (±100
nA).
C3 100µF
Connect the output capacitor between Vo1, Vo2 terminals and GND terminal without fail in order to
stabilize output voltage. The output capacitor has a role to compensate for the phase of loop gain
and to reduce output voltage fluctuation when load is rapidly changed. When there is an
insufficient capacity value, there is a possibility to cause oscillation, and when the equivalent serial
resistance (ESR) of the capacitors is large, output voltage fluctuation is increased when load is
rapidly changed. About 100-µF high-performance electrolytic capacitors are recommended but
output capacitor greatly depends on temperature and load conditions. In addition, when only
ceramic capacitors with low ESR are used, or various capacitors are connected in series, the total
phase allowance of loop gain becomes not sufficient, and oscillation may result. Thoroughgoing
confirmation at application temperature and under load range conditions is requested.
C1 0.1µF
The input capacitor plays a part to lower output impedance of a power supply connected to input
terminals (Vcc). When output impedance of this power supply increases, the input voltages (Vcc,)
become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection
characteristics. The use of capacitors of about 0.1 µF with low ESR, which provide less capacity
value changes caused by temperature changes, is recommended, but since input capacitor greatly
depends on characteristics of the power supply used for input, substrate wiring pattern,
thoroughgoing confirmation under the application temperature and load range, is requested.
C2 10µF
The input capacitor plays a part to lower output impedance of a power supply connected to input
terminals (VIN). When output impedance of this power supply increases, the input voltages (VIN)
become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection
characteristics. The use of capacitors of about 10 µF with low ESR, which provide less capacity
value changes caused by temperature changes, is recommended, but since input capacitor greatly
depends on characteristics of the power supply used for input, substrate wiring pattern,
thoroughgoing confirmation under the application temperature and load range, is requested.
C4 1µF
To the present IC, there mounted is a function (Non Rush Current on Start-up: NRCS) to prevent
rush current from VIN to load and output capacitor via Vo at the output voltage start-up. When the
EN terminal is reset from High or UVLO, constant current is allowed to flow from the NRCS terminal.
By this current, voltage generated at the NRCS terminal becomes the reference voltage and output
voltage is started. In order to stabilize the NRCS set time, it is recommended to use a capacitor (B
special) with less capacity value change caused by temperature change.
C3
C1
Vcc
+
1
2
3
4
8
7
6
5
C4
R1
C2
VIN
Ven
R2
VOUT(1.2V)/2.5A
Technical Note
11/14
www.rohm.com
2010.05 - Rev.
A
© 2010 ROHM Co., Ltd. All rights reserved.
BD3506F,BD3506EFV
About heat loss
In designing heat, operate the apparatus within the following conditions.
(Because the following temperatures are warranted temperature, be sure to take margin, etc. into account.)
1. Ambient temperature Ta shall be not more than 100°C.
2. Chip junction temperature Tj shall be not more than 150°C.
Chip junction temperature Tj can be considered under the following two cases.
Most of heat loss in BD3506F/EFV occurs at the output Nch FET. The power lost is determined by multiplying the voltage
between VIN and Vo by the output current. Confirm voltage and output current conditions of VIN and Vo used, and
collate them with the thermal derating characteristics. Because BD3506EFV employs the power PKG, the thermal
derating characteristics significantly vary in accord with the pc board conditions. When designing, care must be taken to
the size of a pc board to be used.
Power dissipation (W) = {Input voltage (VIN) – Output voltage (V0VREF)}×Io (averaged)
Ex.) If VIN = 1.8 volts, V0=1.2 volts, and Io (averaged)=1.5 A, the power dissipation is given by the following:
Power dissipation (W) =(1.8 volts – 1.2 volts) × 1.5 (A)
= 0.9 W
Equivalent Circuit
Substrate size 70×70×1.6mm
3
(thermal vias in the board.)
Chip junction temperature Tj is found from
IC surface temperature TC under actual
application conditions:
Tj=TC+θj-c×W
Chip junction temperature Tj is found from ambient temperature Ta:
Tj=Ta+θj-a×W
θj-c:SOP8 41.0/W
θj-a:HTSSOP-B20 125.0/W
86.2/W
54.3/W
39.1/W
HTSSOP-B20 45.0/W
Substrate size:70×70×1.6mm
(Substrate surface capper
foil area:less3%)
Reference value
θj-a:SOP8 222.0/W
181.0/W
(IC only)
Single-layer substrate
(substrate surface copper foil area: less 3%)
Single-layer substrate
(substrate surface copper foil area: less 3%))
2nd-layer
(substrate surface copper foil area:15×15mm
2
)
2nd-layer
(substrate surface copper foil area: 70×70mm
2
)
4th-layer
(substrate surface copper foil area: 70×70mm
2
)
θj-a:HTSSOP-B20 125.0/W
86.2/W
54.3/W
39.1/W
Reference value
Vcc
Vo1
Vo2
50k
1k
1k
350k
10k
EN
NRCS
Vcc
1k
10k
1k
1k
1k
1k
Vcc
10k
VIN
1k
Vcc
VFB
1k
100k
100k
20pF
Technical Note
12/14
www.rohm.com
2010.05 - Rev.
A
© 2010 ROHM Co., Ltd. All rights reserved.
BD3506F,BD3506EFV
Notes for use
1. Input terminals (VCC,VIN,EN)
In the present IC, EN terminal, VIN terminal, and VCC terminal have an independent construction. In addition, in order to
prevent malfunction at the time of low input, the UVLO function is equipped with the VCC terminal. They begin to start
output voltage when all the terminals reach threshold voltage without depending on the input order of input terminals.
2. Operating range
Within the operating range, the operation and function of the circuits are generally guaranteed at an ambient temperature
within the range specified. The values specified for electrical characteristics may not be guaranteed, but drastic change
may not occur to such characteristics within the operating range.
3. Permissible dissipation
With respect to the permissible dissipation, the thermal derating characteristics are shown in the Exhibit, which we hope
would be used as a good-rule-of-thumb. Should the IC be used in such a manner to exceed the permissible dissipation,
reduction of current capacity due to chip temperature rise, and other degraded properties inherent to the IC would result.
You are strongly urged to use the IC within the permissible dissipation.
4. Built-in thermal shutdown protection circuit
The thermal shutdown circuit is first and foremost intended for interrupt IC from thermal runaway, and is not intended to
protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use
the circuit with the activation of the circuit premised.
5. Inspection by set substrate
In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a
fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. As electrostatic
measures, provide grounding in the assembly process, and take utmost care in transportation and storage. Furthermore,
when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig
and be sure to turn OFF power supply to remove the jig.
6. For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working
temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because
it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute
maximum rating, physical safety measures are requested to be taken, such as fuses, etc..
7. The use in the strong electromagnetic field may sometimes cause malfunction, to which care must be taken.
8. In the event that load containing a large inductance component is connected to the output terminal, and generation of
back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode.
9. We are certain that examples of applied circuit diagrams are recommendable, but you are requested to thoroughly confirm
the characteristics before using the IC. In addition, when the IC is used with the external circuit changed, decide the IC
with sufficient margin provided while consideration is being given not only to static characteristics but also variations of
external parts and our IC including transient characteristics.
OUTPUT PIN
(Example)

BD3506F-E2

Mfr. #:
Manufacturer:
Description:
LDO Voltage Controllers LDO REG CONTROLLER WITH INTEGRATED FET
Lifecycle:
New from this manufacturer.
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