© 2016 Integrated Device Technology, Inc.
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April 20, 2016
3 ESD Protection and EMC Specification
3.1. ESD Protection
All pins have an ESD protection of 2000V according to the Human Body Model (HBM, based on MIL883,
Method 3015.7). The VDDE, VSSE, and AOUT pins have an additional ESD protection of 4000V (HBM).
In addition, Charged Device Model (CDM) tests are processed with protection levels of 750V for corner pins and
500V for all other pins.
The level of ESD protection has been tested with devices in QFN24 4X4mm packages during the product
qualification.
3.2. Latch-Up Immunity
All pins pass ±100mA latch-up test based on testing that conforms to the standard EIA/JESD 78.
3.3. Electromagnetic Emission
The wired emission of externally connected pins of the device is measured according to the following standard:
IEC 61967_4:2002 + A1:2006.
Measurements must be performed with the application circuits described in the ZSSC4151 Application Descrip-
tion.
For the off-board pins, the spectral power measured with the 150 method must not exceed the limits according
to IEC 61967_4k, Annex B.4 code H10kN. For the VSSE pin, the spectral power measured with the 1 method
must not exceed the limits according to IEC 61967_4k, Annex B.4 code 15KmO.
3.4. Conducted Susceptibility (DPI)
The conducted susceptibility of externally connected pins of the device is measured according to the IEC 62132-4
standard, which describes the direct power injection (DPI) test method.
Measurements must be performed with the application circuit described in the ZSSC4151 Application Description.
Measurements are performed with an internal reference capacitor and internal temperature sensor. The sensing
element is replaced by a resistive divider. Calibration is parameterized so that ~50% VDDA is output.
Table 3.1 gives the specifications for the DPI tests. RES refers to the coupling impedance.
Table 3.1 Conducted Susceptibility (DPI) Tests
Test
Frequency Range
Target
(dBm)
Load Pins
Protocol
Error
Band
Comment
DPI, direct
coupled
1MHz to 300MHz
26
VDDE, AOUT
Analog out
± 1%
LOAD RES = 5kΩ
LOAD CAP = 10nF
DPI, direct
coupled
300MHz to
1000MHz
32
VDDE, AOUT
Analog out
± 1%
LOAD RES = 5kΩ
LOAD CAP = 10nF
© 2016 Integrated Device Technology, Inc.
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April 20, 2016
4 Reliability and RoHS Conformity
The ZSSC4151 is qualified according to the AEC-Q100 standard, operating temperature grade 0. The qualifica-
tion is extended to 3000h for the High Temperature Operating Life (HTOL) Test for one lot. Two manufacturing
lots of extended HTOL qualification data (minimum of 3000h test time) for the ZSSC4151 or other products using
identical technology (metallization), the same package supplier, the same package style, and the same die size
within a specific tolerance are used to prove the package and bond reliability in the range of 3000h HTOL.
A FIT rate 10 FIT (temperature = 55°C, confidence level = 60%) is guaranteed. A typical FIT rate of TSMC’s
CV018BCD technology, which is used for the ZSSC4151, is 1 FIT.
The ZSSC4151 complies with the RoHS directive and does not contain hazardous substances.
5 Glossary
Term
Description
ADC
Analog-to-Digital Converter
AEC
Automotive Electronics Council
AFE
Analog Front-End
BAMP
Buffer Amplifier
BR
Bridge Sensor
CDM
Charged Device Model
CM
Command Mode
CMC
Calibration Microcontroller
DAC
Digital-to-Analog Converter
DNL
Differential Nonlinearity
DPI
Direct Power Injection
EMC
Electromagnetic Compatibility
ESD
Electrostatic Discharge
FIT
Failures in Time
FSO
Full Scale Output
HBM
Human Body Model
HTOL
High Temperature Operating Life
I²C
TM
Inter-Integrated Circuitserial two-wire data bus, trademark of NXP
INL
Integral Nonlinearity
LSB
Least Significant Bit
MUX
Multiplexer
NVM
Nonvolatile Memory
© 2016 Integrated Device Technology, Inc.
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April 20, 2016
Term
Description
OWI
One-Wire Interface
PGA
Programmable Gain Amplifier
PTAT
Proportional-to-Absolute Temperature
PTC
Thermistor Positive Temperature Coefficient Resistor
PWR
Power Management and Protection Unit
QFN
Quad-Flat No-Leads IC package
RAM
Random Access Memory
RISC
Reduced Instruction Set Computing
ROM
Read-Only Memory
RMS
Root-Mean-Square
RTD
Resistance Temperature Device
SCCM
Sensor Check and Common Mode Adjustment Unit
SCL
Serial Clock
SDA
Serial Data
SSC
Sensor Short Check (diagnostic feature) or Sensor Signal Conditioner
TQA, TQE, TQI
Temperature range identifier. See specification 2.2.2 for definition.
ZACwire
TM
IDT-specific One-Wire Interface
6 Document Revision History
Revision
Date
Description
1.00
September 13, 2015
First release.
1.01
November 10, 2015
Extended leakage current description in section 2.3.6 for specifications 2.3.6.13
and 2.3.6.14
Updates for table notes for Table 2.3.
Revision of pin names BRP to BR1P and BRN to BR1N.
1.02
April 12, 2016
Added minimum value for ratiometricity error in Table 2.3.
Updated section 4 regarding completion of AEC-Q100 qualification and extension
of the minimum test time to 3000h.
Updated specification 2.3.7.7 for improved accuracy of ±0.35% of FSO at -40°C to
125°C and 0.5% FSO at -40°C to 150°C.
April 20, 2016
Changed to IDT branding.

ZSSC4151AE2W

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Manufacturer:
Description:
SENSOR SIGNAL CONDITIONER
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