ZXMN2F30FH
Issue 1 - January 2008 2 www.zetex.com
© Zetex Semiconductors plc 2008
Absolute maximum ratings
Thermal resistance
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air
conditions.
(b) For a device surface mounted on FR4 PCB measured at t≤ 5 sec.
(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300µs - pulse width limited by maximum junction
temperature.
(d) Thermal resistance from junction to solder-point (at the end of the drain lead).
Parameter Symbol Limit Unit
Drain source voltage V
DSS
20 V
Gate source voltage V
GS
±12 V
Continous Drain Current @ V
GS
=4.5; T
A
=25°C
(b)
@ V
GS
=4.5; T
A
=70°C
(b)
@ V
GS
=4.5; T
A
=25°C
(a)
I
D
4.9
4.0
4.1
A
A
A
Pulsed drain current
(c)
I
DM
22.6 A
Continuous source current (body diode)
(b)
I
S
1.6 A
Pulsed source current (body diode)
(c)
I
SM
22.6 A
Power dissipation at T
A
=25°C
(a)
Linear derating factor
P
D
0.96
7.6
W
mW/°C
Power dissipation at T
A
=25°C
(b)
Linear derating factor
P
D
1.4
11.2
W
mW/°C
Operating and storage temperature range T
j
, T
stg
-55 to 150
°C
Parameter Symbol Limit Unit
Junction to ambient
(a)
R
⍜JA
131 °C/W
Junction to ambient
(b)
R
⍜JA
89 °C/W
Junction to Lead
(d)
R
⍜JL
68 °C/W
