UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to the application note,
“UCSP—A Wafer-Level Chip-Scale Package” available
on Maxim’s web site at http://www.maxim-ic.com/ucsp.
UCSP Marking Information
Pin A1 Bump Indicator
AAA: Product ID code
XXX: Lot Code
MAX9716/MAX9717
Low-Cost, Mono, 1.4W BTL Audio
Power Amplifiers
______________________________________________________________________________________ 13
Selector Guide
PART BTL/SE INPUT GAIN (dB)
MAX9716 — Adjustable
MAX9717A √ Adjustable
MAX9717B √ 6
MAX9717C √ 9
MAX9717D √ 12
Ordering Information (continued)
PART TEMP RANGE
PIN-
PACKAGE
GAIN
(dB)
MAX9717AEBL+TG45 -40°C to +85°C 3 x 3 UCSP Adj.
MAX9717AETA+T -40°C to +85°C 8 TDFN-EP* Adj.
MAX9717AEUA -40°C to +85°C 8 µMAX-EP* Adj.
MAX9717BEBL+TG45 -40°C to +85°C 3 x 3 UCSP 6
MAX9717BETA+T -40°C to +85°C 8 TDFN-EP* 6
MAX9717BEUA -40°C to +85°C 8 µMAX-EP* 6
MAX9717CEBL+TG45 -40°C to +85°C 3 x 3 UCSP 9
MAX9717CETA+T -40°C to +85°C 8 TDFN-EP* 9
MAX9717CEUA -40°C to +85°C 8 µMAX-EP* 9
MAX9717DEBL+TG45 -40°C to +85°C 3 x 3 UCSP 12
MAX9717DETA+T -40°C to +85°C 8 TDFN-EP* 12
MAX9717DEUA -40°C to +85°C 8 µMAX-EP* 12
AAA
XXX
Chip Information
PROCESS: BiCMOS
*
EP = Exposed pad.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
G45 indicates protective die coating.