DLW43MH201XK2L Datasheet DLW43MH201XK2L | P7-P9

Spec No.: JEFL243C-9118B-01 P7/9

MURATA MFG.CO., LTD

Reference Only

Pick- up nozzle

Support pin

P.C.B.

Product

12.6 Attention Regarding P.C.B. Design

< The Arrangement of Products >

P.C.B. shall be designed so that products are

far from the portion of perforation.

The portion of perforation shall be designed

as narrow as possible, and shall be designed

so as not to be applied the stress in the

case of P.C.B. separation.

Products shall not be arranged on the line

of a series of holes when there are big holes in P.C.B.

(Because the stress concentrate on the line of holes.)

< Products Placing >

Support pins shall be set under P.C.B .

to prevent causing a warp to P.C.B.

during placing the products on the other side of P.C.B.

< P.C.B. Separation >

P.C.B. shall not be separated with hand.

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.

12.7 Standard Land Dimensions (Reflow)

∗1 If the pattern is made with wider than 2.1mm. It will result to let component turn around,

because melting speed is different. In the worst case, short circuit between lines may be occured.

∗2 If the pattern is made with less than 0.7mm , in the worst case , short circuit between lines may be

occurred due to the spread of soldering paste or mount placeing accuracy.

∗3 If the pattern is made with wider, the strength of bending will be reduced.

Moreover, if the pattern is made with less than ”3.5mm” dimension , in the worst case short circuit may

be occurred.

∗4 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.

12.8 Standard Soldering Condition

1.Reflow Soldering

(1) Soldering Temperature

Temperature difference between soldering and surface of components must be within 150°C,

in preheating. When components are immersed in liquid after soldering, temperature difference

should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration

in insulation resistance.

Product

P.C.B.

Hole

○

0.7

2.1

3.5

5.9

(in mm)

Spec No.: JEFL243C-9118B-01 P8/9

MURATA MFG.CO., LTD

Reference Only

(2) Soldering Condition

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

Soldering Profile for Lead Free solder (Sn-3.0Ag-0.5Cu solder )

Standard Profile Limit Profile

Pre-heating 150～180°C 、90s±30s

Heating above 220°C、30s～60s above 230°C、60s max.

Peak temperature 245±3°C 260°C、10s

Cycle of reflow 2 times 2 times

2. Reworking with Soldering iron

The following conditions must be strictly followed when using a soldering iron after being

mounted by reflow soldering.

· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.

· Tip temperature: 350°C max. · Tip diameter:φ3mm max.

· Soldering time : 3(+1,-0) seconds. · Times : 2times max.

Notes : Do not touch the products directly with the soldering iron.

3. Solder Volume

Solder shall be used not to be exceeded the upper limits as shown below.

Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

In case if the solder volume is much, we recommend to make the size of the solder paste

with less than the land pattern.

12.9 Caution for use

･When you hold products with a tweezer, please hold like a figure of the right side,

and sharp material, such as a pair of tweezers, shall not be touched to the winding

portion to prevent the breaking of wire.

･Mechanical shock should not be applied to the products mounted on the board

to prevent the breaking of the core.

150

90s±30s

Time(s)

245±3°C

Tem

(°C)

220°C

30～60s

180

260°C

230°C

60s max.

Limit Profile

Standard Profile

ｔ

1 /3T

≦

T(T:Thickness o

elect

ode)

Uppe

limit

Recommendable

tweezer

Spec No.: JEFL243C-9118B-01 P9/9

MURATA MFG.CO., LTD

Reference Only

12.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening

screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

12.11 Brushing of neighborhood of products

When you clean the neighborhood of products such as connector pins, bristles of cleaning brush

shall not be touched to the winding portion to prevent the breaking of wire.

12.12 Operating Environment

Do not use this product under the following environmental conditions, on deterioration

of the performance, such as insulation resistance may result from the use.

(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

12.13 Storage Condition

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage environment conditions

·Products should be stored in the warehouse on the following conditions.

Temperature ： -10 ~ +40°C

Humidity ： 15 to 85% relative humidity No rapid change on temperature and humidity.

· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,

to prevent the following deterioration.

Poor solderability due to the oxidized electrode.

· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.

· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

· Products should not be stored under the air tights packaged condition.

(3) Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

13．! Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering.

P1-P3 P4-P6 P7-P9

DLW43MH201XK2L

Mfr. #:

Buy DLW43MH201XK2L

Manufacturer:

Murata Electronics

Description:

Common Mode Chokes / Filters 4532mm 110mA 20Vdc 4.35ohm 200uH

Lifecycle:

New from this manufacturer.

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