Package mechanical data STM6522
16/25 Doc ID 17045 Rev 3
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
STM6522 Package mechanical data
Doc ID 17045 Rev 3 17/25
Figure 13. TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm pitch package outline
Table 6. TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm pitch package mechanical data
Symbol
Dimension (mm) Dimension (inches)
Min. Nom. Max. Min. Nom. Max.
A 0.70 0.75 0.80 0.028 0.030 0.031
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.15 0.20 0.25 0.006 0.008 0.010
D
BSC
1.9 2.00 2.1 0.075 0.079 0.083
E
BSC
1.9 2.00 2.1 0.075 0.079 0.083
e 0.50 0.020
L 0.45 0.55 0.65 0.018 0.022 0.026
e
L
BOTTOM VIEW
8
5
Pin#1 ID
1
PIN 1 INDEX AREA
4
b
E
0.10
C
A
A1
PLANE
SEAT ING
TOP VIEW
2x
2x
D
PIN 1 INDEX AREA
0.10 C
0.10 C
0.08 C
0.10 C A B
B
A
C
8070540_A
SIDE VIEW
Package footprint STM6522
18/25 Doc ID 17045 Rev 3
7 Package footprint
Figure 14. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad
Table 7. Parameters for landing pattern - TDFN 8-lead 2 x 2 mm package
Parameter Description
Dimension (mm)
Min. Nom. Max.
L Contact length 1.05
1.15
b Contact width 0.25
0.30
E Max. land pattern Y-direction
2.85
E1 Contact gap spacing 0.65
D Max. land pattern X-direction 1.75
P Contact pitch 0.5
AM00441
D
P
E1E
L
b

STM6522AAAADG6F

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Supervisory Circuits Smart Reset Cap Adjust Setup Delay
Lifecycle:
New from this manufacturer.
Delivery:
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