PS9113
R08DS0124EJ0300 Rev.3.00 Page 11 of 13
Jan 28, 2016
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220C 60 seconds or less
• Time to preheat temperature from 120 to 180C 12030 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt% is
recommended.)
(2) Wave soldering
Temperature 260C or below (molten solder temperature)
Time 10 seconds or less
Preheating conditions 120C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
Peak Temperature (lead part temperature) 350C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100C
(4) Cautions
Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
220°C
Package Surface Temperature T (°C)
Time (s)
(heating)
to 10 s
to 60 s
260°C MAX.
Recommended Temperature Profile of Infrared Reflow
120±30 s
(preheating)
180°C
120°C
