EE-SY125

298 Photomicrosensor (Reflective) EE-SY125
Photomicrosensor (Reflective)
EE-SY125
Dimensions
Note: All units are in millimeters unless otherwise indicated.
Features
Ultra-compact model.
PCB surface mounting type
Absolute Maximum Ratings (Ta = 25°C)
Note: 1. Refer to the temperature rating chart if the ambient temper-
ature exceeds 25°C.
2. The pulse width is 10 µs maximum with a frequency of 100 Hz.
3. Complete soldering within 10 seconds.
Ordering Information
Electrical and Optical Characteristics (Ta = 25°C)
Note: The letter “d” indicates the distance between the top surface of the sensor and the sensing object.
Internal Circuit
Terminal No. Name
A Anode
K Cathode
C Collector
E Emitter
A
K
C
E
Unless otherwise specified, the
tolerances are ±0.15 mm.
Item Symbol Rated value
Emitter Forward current I
F
50 mA (see note 1)
Pulse forward
current
I
FP
1 A (see note 2)
Reverse voltage V
R
4 V
Detector Collector–Emitter
voltage
V
CEO
30 V
Emitter–Collector
voltage
V
ECO
5 V
Collector current I
C
20 mA
Collector
dissipation
P
C
75 mW (see note 1)
Ambient
temperature
Operating Topr –25°C to 85°C
Storage Tstg 40°C to 100°C
Soldering temperature Tsol 260°C (see note 3)
Description Model
Photomicrosensor (reflective) EE-SY125
Item Symbol Value Condition
Emitter Forward voltage V
F
1.2 V typ., 1.4 V max. I
F
= 20 mA
Reverse current I
R
0.01 µA typ., 10 µA max. V
R
= 4 V
Peak emission wavelength λ
P
950 nm typ. I
F
= 4 mA
Detector Light current I
L
50 µA min., 300 µA max. I
F
= 4 mA, V
CE
= 2 V
Aluminum-deposited surface,
d = 1 mm (see note)
Dark current I
D
2 nA typ., 200 nA max. V
CE
= 10 V, 0 lx
Leakage current I
LEAK
200 nA max. I
F
=4 mA, V
CE
= 2 V with no reflection
Collector–Emitter saturated
voltage
V
CE
(sat) --- ---
Peak spectral sensitivity
wavelength
λ
P
930 nm typ. V
CE
= 10 V
Rising time tr 35 µs typ. V
CC
= 2 V, R
L
= 1 k, I
L
= 100 µA
Falling time tf 25 µs typ. V
CC
= 2 V, R
L
= 1 k, I
L
= 100 µA
Photomicrosensor (Reflective) EE-SY125 299
Engineering Data
Forward Current vs. Collector
Dissipation Temperature Rating
Light Current vs. Forward Current
Characteristics (Typical)
Light Current vs. CollectorEmitter
Voltage Characteristics (Typical)
Relative Light Current vs.
Ambient Temperature
Characteristics (Typical)
Dark Current vs. Ambient
Temperature Characteristics
(Typical)
Response Time vs. Load Resistance
Characteristics (Typical)
Response Time vs. Load Resistance
Characteristics (Typical)
Response Time Measurement
Circuit
Distance d (mm)
Relative Light Current vs.
Card Moving Distance (1)
Input
Output
Input
Output
90 %
10 %
Sensing Distance Characteristics
(Typical)
Relative Collector Current vs.
Card Moving Distance (2)
d = 1 mm
Sensing object:
Aluminum-deposited
surface
d = 1 mm
Sensing object:
Aluminum-deposited
surface
d = 1 mm
Sensing object:
Aluminum-deposited
surface
Light current I
L
(mA)
Card moving distance L (mm)
Dark Current I
CEO
(A)
Light current I
L
(µA)
Card movin
g
distance L
(
mm
)
Ta = 25°C
V
CE
= 2 V
Ta = 25°C
Response time tr (µs)
T
A
= 25°C
I
F
= 4 mA
V
CE
= 2 V
Ambient temperature Ta (°C)
Collector dissipation Pc (mW)
Forward current I
F
(mA)
Forward current I
F
(mA)
Light current I
L
(µA)
CollectorEmitter voltage V
CE
(V)
Light current I
L
(µA)
Ambient temperature Ta (°C)
I
F
= 4 mA
V
CE
= 2 V
Relative light current I
L
(%)
Relative light current I
L
(%)
Ambient temperature Ta (°C)
Light current I
L
(µA)
Relative light current I
L
(%)
Response time tr (µs)
IF
PC
300 Photomicrosensor (Reflective) EE-SY125
Precautions
Soldering Information
Reflow soldering
Set the reflow oven so that the temperature profile shown in the fol-
lowing chart is obtained for the upper surface of the product being
soldered.
Manual soldering
Use a soldering iron of less than 25 W, and keep the temperature of
the iron tip at 260°C or below.
Solder each point for a maximum of three seconds.
After soldering, allow the product to return to room temperature
before handling it.
Storage
To protect the product from the effects of humidity until the package
is opened, dry-box storage is recommended. If this is not possible,
store the product under the following conditions:
Temperature: 5 to 30°C
Humidity: 70% max.
The product is packed in a humidity-proof envelope. Reflow soldering
must be done within 48 hours after opening the envelope, during
which time the product must be stored at 5 to 25°C at 60% maximum
humidity.
If it is necessary to store the product after opening the envelope, use
dry-box storage or reseal the envelope at 5 to 30°C at 70% maximum
humidity within two weeks.
Baking
If a product has remained packed in a humidity-proof envelope for six
months or more, or if more than 48 hours have lapsed since the
envelope was opened, bake the product under the following condi-
tions before use only one time:
Bulk: 125°C for 16 to 24 hours
10 sec. max.
240°C max.
Time
120 sec. max.
1 to 4°C/s max.
60 sec. max.
1 to 4°C/s
max.
Temperature
90 sec. max.
1 to 4°C/s
200°C
165°C max.

EE-SY125

Mfr. #:
Manufacturer:
Omron Electronics
Description:
Optical Switches, Reflective, Phototransistor Output REFL PHOTOTRANSISTOR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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