HMC1169 Data Sheet
Rev. 0 | Page 12 of 12
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
03-04-2015-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
1.00
0.90
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.45
0.40
0.35
0.20 MIN
3.80
3.65 SQ
3.50
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4.
PKG-000000
3.50 REF
Figure 18. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.90 mm Package Height
(HCP-32-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range MSL Rating
2
Package Description Package Option Qty. Branding
3
HMC1169LP5E −40°C to +85°C MSL3 32-Lead LFCSP HCP-32-1
HMC1169LP5ETR −40°C to +85°C MSL3 32-Lead LFCSP, 7” Tape and Reel HCP-32-1 500
EV1HMC1169LP5 Evaluation Board
1
The HMC1169LP5E and HMC1169LP5ETR are RoHS compliant parts.
2
See the Absolute Maximum Ratings section, Table 2.
3
XXXX is a placeholder for the 4-digit lot number.
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D13947-0-1/16(0)
