HV supercapacitors
Cylindrical cells
Technical Data 4376
Effective May 2016
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2016 Eaton
All Rights Reserved
Printed in USA
Publication No. 4376-BU-MC16012
May 2016
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of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Wave solder profile
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and soak • Temperature max. (T
smax
) 100 °C 100 °C
• Time max. 60 seconds 60 seconds
D
preheat to max Temperature
160 °C max. 160 °C max.
Peak temperature (T
P
)* 220 °C – 260 °C 250 °C – 260 °C
Time at peak temperature (t
p
) 10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate ~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25 °C to 25 °C 4 minutes 4 minutes
Manual solder
+350 °C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended.
Cleaning/Washing
Avoid cleaning of circuit boards, however if the circuit board must be cleaned use static or ultrasonic immersion in a standard circuit board
cleaning fluid for no more than 5 minutes and a maximum temperature of +60 °C. Afterwards thoroughly rinse and dry the circuit boards. In
general, treat supercapacitors in the same manner you would an aluminum electrolytic capacitor.
Temperature
Time
T
T
smax
T
styp
T
p
t
p
First Wave
Second Wave
Preheat area
Cool down area
