NB3F8L3005C
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FUNCTION TABLES
Table 3. CLOCK ENABLE (SELx) FUNCTION TABLE
SEL Input Selected Input Clock
0 CLK/CLK
1 Crystal Osc Input
Table 4. CLOCK OUTPUT ENABLE (OE) FUNCTION
TABLE
OE Input Q
n
Outputs
0 Disabled, High Impedance
1 Outputs Enabled
Table 5. CLK INPUT VS. OUTPUT STATUS
Input Condition Output
CLK/CLK = OPEN Logic LOW
CLK/CLK = GND Undefined
CLK = HIGH; CLK = LOW Logic HIGH
CLK = LOW; CLK = HIGH Logic LOW
Table 6. CRYSTAL CHARACTERISTICS
Parameter Min Typ Max Unit
Mode of Oscillation Fundamental
Frequency 10 50 MHz
Equivalent Series Resistance (ESR) 50
W
Shunt Capacitance 7 pF
Drive Power 100
mW
Table 7. ATTRIBUTES
Characteristic Value
ESD Protection Human Body Model
Machine Model
>2 kV
200 V
Moisture Sensitivity (Note 2) QFN24 Level 3
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 474
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 8. MAXIMUM RATINGS (Note 3)
Symbol
Parameter Condition Rating Unit
V
DD
,
VDDO
x
Positive Power Supply GND = 0 V 4.6 V
V
I
Input Voltage
XTAL_IN
Diff, SELx, OE Inputs
0 v V
I
v V
DD
–0.5 v V
I
v V
DD
+ 0.5
V
V
O
Output Voltage – 0.5 v V
O
v VDDO
x
+ 0.5 V
T
stg
Storage Temperature Range −65 to +150
_C
θ
JA
Thermal Resistance (Junction−to−Ambient) QFN24
QFN24
0 lfpm
500 lfpm
37
32
_C/W
θ
JC
Thermal Resistance (Junction−to−Case) QFN24 (Note 3) 11
_C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power).
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Table 9. POWER SUPPLY CHARACTERISTICS V
DD
V
DDO
; V
DD
= 3.3 V ± 5% (3.135 V to 3.465 V) or V
DD
= 2.5 V ±5%
(2.375 V to 2.625 V) and V
DDOx
= 3.3 V ± 5% (3.135 V to 3.465 V) or 2.5 V ± 5% (2.375 V to 2.625 V) or 1.8 V ± 0.2 V (1.6 V to 2.0 V)
or 1.5 V ± 0.15 V (1.35 V to 1.65 V); T
A
= −40°C to 85°C
Symbol
Parameter Test Conditions Min Typ Max Unit
I
DD
V
DD
Power Supply Current f
IN
= 0 MHz
V
DDO
= 3.3 V, f
IN
= 100 MHz
V
DDO
= 2.5 V, f
IN
= 100 MHz
30
30
20
38 mA
I
DDO
V
DDO
Power Supply
Current
OE = 0, no load
V
DDO
= 3.3 V, OE = 1, f
IN
= 100 MHz
V
DDO
= 2.5 V, OE = 1, f
IN
= 100 MHz
0.1
7
5
mA
I
DD
+
I
DDO
Total Device Current with
Loads on All Outputs
OE = 1, f
IN
= 100 MHz
OE = 0
48
16
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
Table 10. DC CHARACTERISTICS T
A
= −40°C to 85°C
Symbol
Parameter Test Conditions Min Typ Max Unit
V
IH
LVCMOS / LVTTL Input High Voltage
(OE, SEL)
V
DD
= 3.3 V ±5%
V
DD
= 2.5 V ± 5%
1.6
1.3
V
DD
+ 0.3
V
DD
+ 0.3
V
V
IL
LVCMOS / LVTTL Input Low Voltage
(OE, SEL)
V
DD
= 3.3 V ±5%
V
DD
= 2.5 V ± 5%
−0.3
−0.3
0.8
0.4
V
I
IH
Input High Current
OE, SEL
CLK/CLK
V
DD
= V
IN
= 3.465 V
V
DD
= V
IN
= 3.465 V or 2.625 V
100
100
mA
I
IL
Input Low Current
OE, SEL
CLK
CLK
V
DD
= 3.465 V; V
IN
= 0.0 V
V
DD
= 3.465 V or 2.625 V V
IN
= 0.0 V
V
DD
= 3.465 V or 2.625 V V
IN
= 0.0 V
−5
−5
−150
5
mA
V
OH
Output High Voltage V
DDO
− 0.1
V
V
OL
Output Low Voltage
VDDO
x
= 3.3 V ± 5% or 2.5 V ± 5% 0.5
V
VDDO
x
= 1.8 V ± 0.2 V 0.4
VDDO
x
= 1.5 V ± 0.15 V 0.37
V
PP
Peak−to−Peak Input Voltage
V
IL
> −0.3 V CLKx/CLKx
V
DD
= 3.3 V ±5% or V
DD
= 2.5 V ± 5% 0.15 1.3 V
V
IHCMR
Input High Level Common Mode
Range
V
CM
= V
IH
; V
IL
> −0.3 V CLKx/CLKx
V
DD
= 3.3 V ±5% or V
DD
= 2.5 V ± 5% 0.5 V
DD
− 0.85 V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
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Table 11. AC CHARACTERISTICS V
DD
V
DDO
; V
DD
= 3.3 V ± 5% (3.135 V to 3.465 V) or V
DD
= 2.5 V ±5% (2.375 V to 2.625 V)
and V
DDOx
= 3.3 V ± 5% (3.135 V to 3.465 V) or 2.5 V ± 5% (2.375 V to 2.625 V) or 1.8 V ± 0.2 V (1.6 V to 2.0 V) or 1.5 V ± 0.15 V
(1.35 V to 1.65 V); T
A
= −40°C to 85°C
Symbol
Parameter Test Conditions Min Typ Max Unit
f
MAX
Output Frequency
Using External
Crystal
10 50 MHz
Using External
Clock Source
(Note 4)
DC 200 MHz
t
sk(o)
Output Skew (Notes 5 and 6) 10 25 ps
t
JITTER
F
Additive RMS
Phase Jitter
(Integrated
12 kHz − 20 MHz)
f
C
= 156.25 MHz
Input clock from
CLK/CLK
V
DDOx
= 3.3 V ± 5% 0.03
ps
V
DDOx
= 2.5 V ± 5% 0.03
V
DDOx
= 1.8 V ± 0.2 V 0.03
V
DDOx
= 1.5 V ± 0.15 V 0.03
External clock
over drives
crystal interface
V
DDOx
= 3.3 V ± 5% 0.03
V
DDOx
= 2.5 V ± 5% 0.03
V
DDOx
= 1.8 V ± 0.2 V 0.03
V
DDOx
= 1.5 V ± 0.15 V 0.03
Input clock from
crystal
V
DDOx
= 3.3 V ± 5% 0.03
V
DDOx
= 2.5 V ± 5% 0.03
V
DDOx
= 1.8 V ± 0.2 V 0.03
V
DDOx
= 1.5 V ± 0.15 V 0.03
t
R
/ t
F
Output Rise/Fall Time (20% and 80%)
C
L
= 10 pF
V
DDOx
= 3.3 V ± 5% 150 350 500
ps
V
DDOx
= 2.5 V ± 5% 150 350 500
V
DDOx
= 1.8 V ± 0.2 V 150 350 600
V
DDOx
= 1.5 V ± 0.15 V 150 350 600
odc Output Duty Cycle
V
DDOx
= 3.3 V ± 5% 45 55
%
V
DDOx
= 2.5 V ± 5% 40 60
V
DDOx
= 1.8 V ± 0.2 V 40 60
V
DDOx
= 1.5 V ± 0.15 V 40 60
PSRR Power Supply
Ripple Rejection
100 kHz, 100 mV
PP
Ripple Injected on V
DD
,
V
DDO
= 2.5 V
−44 dBc
t
EN
Output Enable
Time (Note 7)
OE 4 cycles
t
DIS
Output Disable
Time (Note 7)
OE 4 cycles
MUX_
ISOLATION
MUX_
ISOLATION
155.52 MHz 55 dB
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
4. XTAL_IN can be overdriven relative to a signal a crystal would provide.
5. Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO
x
/2.
6. This parameter is defined in accordance with JEDEC Standard 65.
7. These parameters are guaranteed by characterization. Not tested in production. See Parameter Measurement Information
8. AC parameters for LVCMOS are dependent upon output capacitive loading.

NB3F8L3005CMNTBG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 1:5 LVCMOS FANOUT BUFFER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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