© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 3
1 Publication Order Number:
NVMFS5885NL/D
NVMFS5885NL
Power MOSFET
60 V, 15 mW, 39 A, Single N−Channel
Features
• Small Footprint (5x6 mm) for Compact Design
• Low R
DS(on)
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• NVMFS5885NLWF − Wettable Flanks Product
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
60 V
Gate−to−Source Voltage V
GS
"20 V
Continuous Drain Cur-
rent R
Y
J−mb
(Notes 1,
2, 3)
Steady
State
T
mb
= 25°C
I
D
39
A
T
mb
= 100°C 28
Power Dissipation
R
Y
J−mb
(Notes 1, 2, 3)
T
mb
= 25°C
P
D
54
W
T
mb
= 100°C 27
Continuous Drain Cur-
rent R
q
JA
(Notes 1 &
3)
Steady
State
T
A
= 25°C
I
D
10.2
A
T
A
= 100°C 7.2
Power Dissipation
R
q
JA
(Notes 1 & 3)
T
A
= 25°C
P
D
3.7
W
T
A
= 100°C 1.8
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
179 A
Operating Junction and Storage Temperature T
J
, T
stg
−55 to
175
°C
Source Current (Body Diode) I
S
46 A
Single Pulse Drain−to−Source Avalanche
Energy (T
J
= 25°C, V
DD
= 50 V, V
GS
= 10 V,
I
L(pk)
= 18 A, L = 0.3 mH, R
G
= 25 W)
E
AS
49 mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
Junction−to−Mounting Board (top) − Steady
State (Notes 2, 3)
R
Y
J−mb
2.8
°C/W
Junction−to−Ambient − Steady State (Note 3)
R
q
JA
41
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surface−mounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
MARKING
DIAGRAM
http://onsemi.com
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
XXXXXX
AYWZZ
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
60 V
15 mW @ 10 V
39 A
21 mW @ 4.5 V
G (4)
S (1,2,3)
N−CHANNEL MOSFET
D (5,6)
S
S
S
G
D
D
D
D
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
1
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
