V6
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
7
Chip Outline Drawing
1,2
MASW-002100-1191
DIM INCHES MM
MIN. MAX. MIN. MAX.
A
0.029 0.033 0.73 0.83
B
0.004 0.006 0.10 0.15
C
0.004 REF 0.10 REF
D
0.005 REF 0.13 REF
E
0.009 REF 0.23 REF
F
0.023 REF 0.58 REF
G
0.007 REF 0.17 REF
H
0.004 REF 0.10 REF
Notes:
1. Topside and backside surface metallization is gold , 2.5μm thick typical.
2. Yellow areas indicate wire bonding pads
