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MC74HCT365ADR2G

P1-P3P4-P6P7-P7
MC74HCT365A
http://onsemi.com
4
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input t
r
= t
f
= 6 ns)
Symbol Parameter
V
CC
V
Guaranteed Limit
Unit
– 55 to
25_C
v 85_C v 125_C
t
PLH
,
t
PHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 3)
4.5 24 30 36 ns
t
PLZ
,
t
PHZ
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
4.5 44 55 66 ns
t
PZL
,
t
PZH
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
4.5 44 55 66 ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
4.5 12 15 18 ns
C
in
Maximum Input Capacitance — 10 10 10 pF
C
out
Maximum Three−State Output Capacitance
(Output in High−Impedance State)
— 15 15 15 pF
C
PD
Power Dissipation Capacitance (Per Buffer)*
Typical @ 25°C, V
CC
= 5.0 V
pF
60
* Used to determine the no−load dynamic power consumption: P
D
= C
PD
V
CC
2
f + I
CC
V
CC
.
MC74HCT365A
http://onsemi.com
5
SWITCHING WAVEFORMS
(V
I
= 0 to 3 V, V
M
= 1.3 V)
V
CC
GND
t
f
t
r
INPUT A
(V
I
)
OUTPUT Y
10%
V
M
90%
10%
50%
90%
t
TLH
t
PLH
t
PHL
t
THL
OUTPUT ENABLE
(V
I
)
OUTPUT Y
OUTPUT Y
V
M
50%
50%
90%
10%
t
PZL
t
PLZ
t
PZH
t
PHZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
Figure 1. Figure 2.
TEST CIRCUITS
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH
.
1 kΩ
Figure 3. Figure 4.
INPUT A
OUTPUT ENABLE 1
OUTPUT ENABLE 2
V
CC
TO OTHER
FIVE BUFFERS
Y
LOGIC DETAIL
ONE OF 6
BUFFERS
MC74HCT365A
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
P1-P3P4-P6P7-P7

MC74HCT365ADR2G

Mfr. #:
Buy MC74HCT365ADR2G
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers IC BUFF/DVR TRI-ST HEX
Lifecycle:
New from this manufacturer.
Delivery:
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