ADF4110/ADF4111/ADF4112/ADF4113 Data Sheet
Rev. F | Page 28 of 28
ORDERING GUIDE
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ADF4110BCPZ –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4110BCPZ-RL –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4110BCPZ-RL7 –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4110BRU –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4110BRU-REEL –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4110BRU-REEL7 -40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4110BRUZ –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4110BRUZ-RL –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4110BRUZ-RL7 –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
20-Lead Frame Chip Scale Package [LFCSP_WQ]
ADF4111BCPZ-RL –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4111BCPZ-RL7 –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4111BRU –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4111BRUZ –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4111BRUZ-RL –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4111BRUZ-RL7 –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4112BCPZ –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4112BCPZ-RL –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4112BCPZ-RL7 –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4112BRU –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4112BRU-REEL7 –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4112BRUZ –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4112BRUZ-REEL –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
16-Lead Thin Shrink Small Outline Package [TSSOP]
ADF4113BCPZ –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
20-Lead Frame Chip Scale Package [LFCSP_WQ]
ADF4113BCPZ-RL7 –40°C to +85°C 20-Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4113BRU –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4113BRU-REEL7 –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4113BRUZ –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4113BRUZ-REEL –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4113BRUZ-REEL7 –40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4113BCHIPS –40°C to +85°C DIE
EVAL-ADF4113EBZ1 Evaluation Board
EVAL-ADF4113EBZ2 Evaluation Board
EV-ADF411XSD1Z Evaluation Board
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Z = RoHS Compliant Part.
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CP-20-6 package was formerly CP-20-1 package.
Purchase of licensed I
2
C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I
2
C Patent
Rights to use these components in an I
2
C system, provided that the system conforms to the I
2
C Standard Specification as defined by Philips.
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D03496-0-1/13(F)
