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MC74LCX240DWR2

P1-P3P4-P6P7-P7
MC74LCX240
http://onsemi.com
4
DC ELECTRICAL CHARACTERISTICS (Continued)
T
A
= −40C to +85C
Symbol Characteristic Condition Min Max Units
V
OL
LOW Level Output Voltage
2.7 V V
CC
3.6 V; I
OL
= 100 mA
0.2 V
V
CC
= 2.7 V; I
OL
= 12 mA 0.4
V
CC
= 3.0 V; I
OL
= 16 mA 0.4
V
CC
= 3.0 V; I
OL
= 24 mA 0.55
I
OZ
3−State Output Current V
CC
= 3.6 V, V
IN
= V
IH
or V
IL
,
V
OUT
= 0 to 5.5 V
5
mA
I
OFF
Power Off Leakage Current V
CC
= 0, V
IN
= 5.5 V or V
OUT
= 5.5 V 10
mA
I
IN
Input Leakage Current V
CC
= 3.6 V, V
IN
= 5.5 V or GND 5
mA
I
CC
Quiescent Supply Current V
CC
= 3.6 V, V
IN
= 5.5 V or GND 10
mA
DI
CC
Increase in I
CC
per Input 2.3 V
CC
3.6 V; V
IH
= V
CC
− 0.6 V 500
mA
AC CHARACTERISTICS (t
R
= t
F
= 2.5 ns; C
L
= 50 pF; R
L
= 500 W)
Limits
T
A
= −40C to +85C
V
CC
= 3.0 V to 3.6 V V
CC
= 2.7 V
Symbol Parameter Waveform Min Max Max Units
t
PLH
t
PHL
Propagation Delay
Input to Output
1 1.5
1.5
6.5
6.5
7.5
7.5
ns
t
PZH
t
PZL
Output Enable Time to
High and Low Level
2 1.5
1.5
8.0
8.0
9.0
9.0
ns
t
PHZ
t
PLZ
Output Disable Time From
High and Low Level
2 1.5
1.5
7.0
7.0
8.0
8.0
ns
t
OSHL
t
OSLH
Output−to−Output Skew
(Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
OSHL
) or LOW−to−HIGH (t
OSLH
); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25C
Symbol Characteristic Condition Min Typ Max Units
V
OLP
Dynamic LOW Peak Voltage (Note 4) V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V 0.8 V
V
OLV
Dynamic LOW Valley Voltage (Note 4) V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V 0.8 V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
C
IN
Input Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
7 pF
C
OUT
Output Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
8 pF
C
PD
Power Dissipation Capacitance 10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
25 pF
MC74LCX240
http://onsemi.com
5
WAVEFORM 1 - PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
2.7 V
0 V
V
OH
V
OL
1Dn, 2Dn
1On
, 2On
t
PLH
t
PHL
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
2.7 V
0 V
0 V
1OE, 2OE
1On, 2On
t
PZH
3.0 V
t
PHZ
t
PZL
t
PLZ
1On, 2On
1.5 V
1.5 V
1.5 V1.5 V
1.5 V 1.5 V
Figure 3. Waveforms
1.5 V
V
CC
V
OH
- 0.3 V
V
OL
+ 0.3 V
GND
OPEN
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
R
1
C
L
6V
GND
TEST
SWITCH
t
PLH
, t
PHL
Open
t
PZL
, t
PLZ
6V
Open Collector/Drain t
PLH
and t
PHL
6V
t
PZH
, t
PHZ
GND
C
L
= 50 pF or equivalent (Includes jig and probe capacitance)
R
L
= R
1
= 500 W or equivalent
R
T
= Z
OUT
of pulse generator (typically 50 W)
Figure 4. Test Circuit
MC74LCX240
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P7

MC74LCX240DWR2

Mfr. #:
Buy MC74LCX240DWR2
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers 2-36.V Octal 3-State
Lifecycle:
New from this manufacturer.
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