IRL2505PBF

IRL2505PbF
HEXFET
®
Power MOSFET
l Advanced Process Technology
l Ultra Low On-Resistance
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
Fifth Generation HEXFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
HEXFET Power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device for
use in a wide variety of applications.
The TO-220 is universally preferred for all commercial-
Industrial applications at power dissipation levels to
approximately 50 watts. The low thermal resistance and
low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
Description
V
DSS
= 55V
R
DS(on)
= 0.008
I
D
= 104A
S
D
G
l Logic-Level Gate Drive
TO-220AB
Absolute Maximum Ratings
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 104
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 74 A
I
DM
Pulsed Drain Current 360
P
D
@T
C
= 25°C Power Dissipation 200 W
Linear Derating Factor 1.3 W/°C
V
GS
Gate-to-Source Voltage ± 16 V
E
AS
Single Pulse Avalanche Energy 500 mJ
I
AR
Avalanche Current 54 A
E
AR
Repetitive Avalanche Energy 20 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and 55 to + 175
T
STG
Storage Temperature Range °C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 0.75
R
θCS
Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W
Thermal Resistance
––– 62
R
θJA
Juction-to-Ambient
Mounting torque, 6-32 or M3 srew
10 lbf•in (1.1N•m)
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8/3/04
PD -95622
l Lead-Free
IRL2505PbF
2 www.irf.com
Calculated continuous current based on maximum allowable
junction temperature;for recommended current-handling of the
package refer to Design Tip # 93-4
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 55   V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient  0.035  V/°C Reference to 25°C, I
D
= 1mA
  0.008 V
GS
= 10V, I
D
= 54A
  0.010 V
GS
= 5.0V, I
D
= 54A
  0.013 V
GS
= 4.0V, I
D
= 45A
V
GS(th)
Gate Threshold Voltage 1.0  2.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 59   S V
DS
= 25V, I
D
= 54A
  25 V
DS
= 55V, V
GS
= 0V
  250 V
DS
= 44V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage   100
nA
V
GS
= 16V
Gate-to-Source Reverse Leakage   -100 V
GS
= -16V
Q
g
Total Gate Charge   130 I
D
= 54A
Q
gs
Gate-to-Source Charge   25 nC V
DS
= 44V
Q
gd
Gate-to-Drain ("Miller") Charge   67 V
GS
= 5.0V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time  12  V
DD
= 28V
t
r
Rise Time  160  I
D
= 54A
t
d(off)
Turn-Off Delay Time  43  R
G
= 1.3Ω, V
GS
= 5.0V
t
f
Fall Time  84  R
D
= 0.50Ω, See Fig. 10
Between lead,
 
and center of die contact
C
iss
Input Capacitance  5000  V
GS
= 0V
C
oss
Output Capacitance  1100  pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance  390   = 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
nH
R
DS(on)
Static Drain-to-Source On-Resistance
L
S
Internal Source Inductance 7.5
ns
I
DSS
Drain-to-Source Leakage Current
µA
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
 
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
 
p-n junction diode.
V
SD
Diode Forward Voltage   1.3 V T
J
= 25°C, I
S
= 54A, V
GS
= 0V
t
rr
Reverse Recovery Time  140 210 ns T
J
= 25°C, I
F
= 54A
Q
rr
Reverse Recovery Charge  650 970 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
S
D
G
A
104
360
Pulse width 300µs; duty cycle 2%.
Notes:
I
SD
54A, di/dt 230A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
V
DD
= 25V, starting T
J
= 25°C, L = 240µH
R
G
= 25, I
AS
= 54A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
GSS
IRL2505PbF
www.irf.com 3
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
1
10
100
1000
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
20µs PULSE WIDTH
T = 25°C
J
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
1
10
100
1000
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
20µs PULSE WIDTH
T = 175°C
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
J
1
10
100
1000
2.5 3.5 4.5 5.5 6.5 7.5
T = 25°C
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
T = 175°C
J
A
V = 25V
20µs PULSE WIDTH
DS
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
5V
90A

IRL2505PBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
Darlington Transistors MOSFET MOSFT 55V 104A 8mOhm 86.7nC LogLvAB
Lifecycle:
New from this manufacturer.
Delivery:
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