PEMB17_PUMB17_3 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 03 — 1 September 2009 3 of 11
NXP Semiconductors
PEMB17; PUMB17
PNP/PNP resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ
5. Limiting values
[1] Device mounted on a FR4 printed-circuit board, single-sided copper, standard footprint.
[2] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
[1] Device mounted on a FR4 printed-circuit board, single-sided copper, standard footprint.
[2] Reflow soldering is the only recommended soldering method.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transistor
V
CBO
collector-base voltage open emitter - −50 V
V
CEO
collector-emitter voltage open base - −50 V
V
EBO
emitter-base voltage open collector - −10 V
V
I
input voltage
positive - +10 V
negative - −40 V
I
O
output current (DC) - −100 mA
I
CM
peak collector current - −100 mA
P
tot
total power dissipation T
amb
≤ 25 °C
SOT363
[1]
- 200 mW
SOT666
[1] [2]
- 200 mW
T
stg
storage temperature −65 +150 °C
T
j
junction temperature - 150 °C
T
amb
ambient temperature −65 +150 °C
Per device
P
tot
total power dissipation T
amb
≤ 25 °C
SOT363
[1]
- 300 mW
SOT666
[1] [2]
- 300 mW
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
R
th(j-a)
thermal resistance from
junction to ambient
T
amb
≤ 25 °C
SOT363
[1]
- - 625 K/W
SOT666
[1] [2]
- - 625 K/W
Per device
R
th(j-a)
thermal resistance from
junction to ambient
T
amb
≤ 25 °C
SOT363
[1]
- - 416 K/W
SOT666
[1] [2]
- - 416 K/W