date 05/02/2017
page
1 of 4
cui.com
SERIES: HSE-BX-035H-01 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• round hole for component attchment
• multiple available cut lengths
MODEL
thermal resistance
1
power
dissipation
1
length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSE-B20254-035H-01 25.4 14.42 14.36 4.42 3.40 5.20
HSE-B20381-035H-01 38.1 10.71 10.51 2.67 2.43 7.00
Note: 1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
012345
6789
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 14.36 4.42 3.40
2 29.79 9.28 6.91
3 44.19 14.08 10.17
4 59.02 18.94 13.61
5 72.18 23.94 17.23
6 84.41 28.75 20.85
7 96.74 33.59 24.38
8 107.41 38.56 27.85
9 118.81 43.41 31.51
10 128.70 48.60 34.77
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20254-035H-01
For more information, please visit the product page.
