4
0
5
10
15
20
25
30
30 32 34 36 38 40 42 44 46 48 50
Frequency [GHz]
S21[dB]
-60
-55
-50
-45
-40
-35
-30
S12 [dB]
S21[dB]
S12[dB]
-25
-20
-15
-10
-5
0
30 32 34 36 38 40 42 44 46 48 50
Frequency [GHz]
Return Loss [dB]
0
2
4
6
8
10
35 37 39 41 43 45
Frequency [GHz]
Noise Figure [dB]
0
5
10
15
20
25
30
34 35 36 37 38 39 40 41
Frequency[GHz]
P1, P3 [dBm], PAE[%]
-70
-60
-50
-40
-30
-20
-10
0
34 35 36 37 38 39 40 41
Frequency [GHz]
Relative IM3 Level [dBc]
-5
0
5
10
15
20
25
30
35
40
-25 -20 -15 -10 -5 0 510
Pin [dBm]
Po[dBm], and, PAE[%]
400
450
500
550
600
650
700
750
800
850
Ids [mA]
S11[dB]
S22[dB]
P-1
PAE@P1
P-3
PAE@P3
SCL=18[dBm]
SCL=12dBm]
SCL=4[dBm]
Pout(dBm)
PAE[%]
Id(total)
Typical Performance
(Data was obtained from a 2.4mm connector based test xture and includes connector and board losses. Connector and
board loss is approximately 0.5dB at input and output ports for an approximate total of 1dB.)
(T
A
= 25°C, Vdd=5V, Idq=0.45 A, V
g
=-1 V, Z
in
= Z
out
= 50 )
Figure 1. Typical gain and reverse Isolation
Figure 3. Typical output power (P-1 and P-3) vs. frequency
Figure 5. Typical third order inter-modulation product level vs. frequency at
di erent single carrier output level (SCL)
Figure 2. Typical return Loss (input and output)
Figure 4. Typical noise gure
Figure 6. Typical output power, PAE, and total drain current versus Input
power at 40GHz
