SCA100T Series
Murata Electronics Oy Subject to changes 16/16
www.murata.com Doc. nr. 82 1178 00 Rev.A2
4.2 Reflow Soldering
The SCA100T is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with
normal SMD pick-and-place equipment.
Figure 16. Recommended SCA100T body temperature profile during reflow soldering. Ref.
IPC/JEDEC J-STD-020B.
Average ramp-up rate (T
L
to T
P
)
Preheat
- Temperature min (T
smin
)
- Temperature max (T
smax
)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Time within 5°C of actual Peak Temperature (T
P
)
Time 25° to Peak temperature
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020B. The part
should be delivered in a dry pack. The manufacturing floor time (out of bag) in the customer’s end
is 168 hours.
Notes:
Preheating time and temperatures according to guidance from solder paste manufacturer.
It is important that the part is parallel to the PCB plane and that there is no angular alignment
error from intended measuring direction during assembly process.
Wave soldering is not recommended.
Ultrasonic cleaning is not allowed. The sensing element may be damaged by an ultrasonic
cleaning process.