TSM3401CX RFG

TSM3401
Taiwan Semiconductor
Document Number: DS_P0000072 1 Version: D15
P-Channel Power MOSFET
-30V, -3A, 60mΩ
Features
Advance Trench Process Technology
High Density Cell Design for Ultra Low On-
resistance
Pb-free plating
RoHS compliant
Halogen-free package
KEY PERFORMANCE PARAMETERS
PARAMETER VALUE UNIT
V
DS
-30 V
R
DS(on)
(max)
V
GS
= -10V
60
V
GS
= -4.5V
90
Q
g
9.52 nC
Application
Load Switch
PA Switch
SOT
-
23
Notes: Moisture sensitivity level: level 3. Per J-STD-020
ABSOLUTE MAXIMUM RATINGS (T
A
= 25°C unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
-30
V
Gate-Source Voltage V
GS
±20
V
Continuous Drain Current
(Note 1)
T
A
= 25°C I
D
-3
A
Pulsed Drain Current
(Note 2)
I
DM
-10 A
Continuous Source Current (Diode Conduction) I
S
-1.9 A
Total Power Dissipation
T
A
= 25°C
P
DTOT
1.25
W
T
A
= 70°C 0.8
Operating Junction and Storage Temperature Range T
J
, T
STG
- 55 to +150 °C
PARAMETER SYMBOL LIMIT UNIT
Junction to Case Thermal Resistance R
ӨJC
75 °C/W
Junction to Ambient Thermal Resistance R
ӨJA
100 °C/W
Notes: R
ӨJA
is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined
at the solder mounting surface of the drain pins. R
ӨJA
is guaranteed by design while R
ӨCA
is determined by the user’s board
design. R
ӨJA
shown below for single device operation on FR-4 PCB in still air.
TSM3401
Taiwan Semiconductor
Document Number: DS_P0000072 2 Version: D15
ELECTRICAL SPECIFICATIONS
(T
A
= 25°C unless otherwise noted)
PARAMETER CONDITIONS SYMBOL
MIN TYP MAX
UNIT
Static
(Note 3)
Drain-Source Breakdown Voltage V
GS
= 0V, I
D
= -250µA BV
DSS
-30 -- -- V
Gate Threshold Voltage V
DS
= V
GS
, I
D
= -250µA V
GS(TH)
-1.0 -1.5 -3.0
V
Gate Body Leakage V
GS
= ±20V, V
DS
= 0V I
GSS
-- -- ±100
nA
Zero Gate Voltage Drain Current V
DS
= -24V, V
GS
= 0V I
DSS
-- -- -1
µA
On-State Drain Current V
DS
= -5V, V
GS
= -10V I
D(ON)
-6 -- --
A
Drain-Source On-State Resistance
V
GS
= -10V, I
D
= -3A
R
DS(ON)
-- 50 60
V
GS
= -4.5V, I
D
= -2A
--
75 90
Forward Transconductance
V
DS
= -15V, I
D
= -5A
g
fs
4 7 --
S
Dynamic
(Note 4)
Total Gate Charge
V
DS
= -15V, I
D
= -3A,
V
GS
= -10V
Q
g
-- 9.52 --
nC
Gate-Source Charge Q
gs
-- 3.43 --
Gate-Drain Charge Q
gd
-- 1.71 --
Input Capacitance
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
C
iss
-- 551.57
--
pF
Output Capacitance C
oss
-- 90.96 --
Reverse Transfer Capacitance C
rss
60.79
Switching
(Note 5)
Turn-On Delay Time
V
DD
= -15V,
R
GEN
= 6Ω,
I
D
= -1A, V
GS
= -10V,
t
d(on)
--
10.8
--
ns
Turn-On Rise Time t
r
-- 2.33 --
Turn-Off Delay Time t
d(off)
-- 22.53 --
Turn-Off Fall Time t
f
-- 3.87 --
Source-Drain Diode
(Note 3)
Forward On Voltage
I
S
= -1.9 A, V
GS
= 0V V
SD
-- -0.8 -1.3 V
Notes:
1. Pulse width limited by the maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 5 sec.
3. Pulse test: PW ≤ 300µs, duty cycle ≤ 2%.
4. For DESIGN AID ONLY, not subject to production testing.
5. Switching time is essentially independent of operating temperature.
TSM3401
Taiwan Semiconductor
Document Number: DS_P0000072 3 Version: D15
ORDERING INFORMATION
PART NO.
PACKAGE
PACKING
TSM3401CX RFG SOT-23 3,000pcs / 7” Reel
Note:
1. Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
2. Halogen-free according to IEC 61249-2-21 definition

TSM3401CX RFG

Mfr. #:
Manufacturer:
Taiwan Semiconductor
Description:
MOSFET 30V P channel Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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