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DS1961K#

P1-P3P4-P4
03/12/2004
RELIABILITY REPORT
FOR
DS1961S
Dallas Semiconductor
4401 South Beltwood Parkway
Dallas, TX 75244-3292
Prepared by:
Ken Wendel
Reliability Engineering Manager
Dallas Semiconductor
4401 South Beltwood Pkwy.
Dallas, TX 75244-3292
Email : ken.wendel@dalsemi.com
ph: 972-371-3726
fax: 972-371-6016
mbl: 214-435-6610
Conclusion:
DS1961S
The following qualification successfully meets the quality and reliability standards required of all Dallas
Semiconductor products and processes:
Module Description:
A description of this Module can be found in the product data sheet. You can find the product data
sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.*
Reliability Derating:
A module device consists of one or more IC's in a single, upward integrated, package. This
package is assembled to include batteries, crystals, and other piece parts that make up the
configuration of the Module. Because of either the complexity of the package or the included piece
parts, standard high temperature reliability testing is not possible. Therefore, in order to determine
the reliability of module products, the reliability of each of the piece parts is individually determined,
then summed to determine the reliability of the integrated module product. If there are "n" significant
components in the module then:
Fr (module) = Fr (1) + Fr (2) + Fr (3) + ..... + Fr (n)
Fr (module) = Failure rate of module
Fr(n) = Failure rate of the nth component
Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate
is related to MTTF by:
MTTF = 1/Fr
NOTE: MTTF is frequently used interchangeably with MTBF.
The calculated failure rate for this module/assembly is:
The parameters used to calculate the module failure rate are as follows:
Cf:
Ea:
0.7
B:
0
Tu:
25
Vu:
5.5
°C Volts
In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing
product will continue to meet Maxim's quality and reliability standards. The current status of the
reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.*
Module Device: Quantity: MTTF (Yrs): FITs:
6.318096DS1961 1
6.318096Totals:
The reliability data follows. A the start of this data is the module assembly information. This is a
description of the module. The next section is the detailed reliability data for each stress found in the
qualification / monitor. If there are additional processes or assemblies used as part of this report, a
description of each will follow which includes the respective reliability data for that process/
assembly. The reliability data section includes the latest data available. Some of this data may be
generic with other packages or products.
* Some proprietary products may be excepted from this requirement.
Assembly Site:
Fastech
Body Size:
16.25mm
Pin Count:
2
Package Type:
iButton F50
Lead Frame:
PCB; FR4
Assembly Information:
Lead Finsh:
Stainless Steel
Glob Top:
FP4323, Dexter Hysol
Die Attach:
Underfill FP4527, Dexter Hysol
Flammability:
UL 94-V0
0303
0230
to
Date Code Range:
ELECTRICAL CHARACTERIZATION
DESCRIPTION READPOINTCONDITION QUANTITY FAILSDATE CODE
10IEC 1000-4-2 CONTACT 2000 VOLTS 3 0ESD SENSITIVITY PUL'S0230
10IEC 1000-4-2 CONTACT 4000 VOLTS 3 0ESD SENSITIVITY PUL'S0230
10IEC 1000-4-2 CONTACT 8000 VOLTS 3 0ESD SENSITIVITY PUL'S0230
10IEC 1000-4-2 AIR 8000 VOLTS 3 0ESD SENSITIVITY PUL'S0230
10IEC 1000-4-2 AIR 10000 VOLTS 3 0ESD SENSITIVITY PUL'S0230
10IEC 1000-4-2 AIR 15000 VOLTS 3 3ESD SENSITIVITY PUL'S0230
10IEC 1000-4-2 AIR 20000 VOLTS 3 3ESD SENSITIVITY PUL'S0230
6Total:
OPERATING LIFE
DESCRIPTION READPOINTCONDITION QUANTITY FAILSDATE CODE
1000125C, 6.0 VOLTS 77 0HIGH VOLTAGE LIFE HRS0230
1000125C, 6.0 VOLTS 77 0HIGH VOLTAGE LIFE HRS0303
0Total:
TEMPERATURE CYCLE
DESCRIPTION READPOINTCONDITION QUANTITY FAILSDATE CODE
1000-55C TO 125C 77 0TEMP CYCLE CYS0240
1000-55C TO 125C 77 0TEMP CYCLE CYS0240
0Total:
W/E ENDURANCE AND DATA RET'N
DESCRIPTION READPOINTCONDITION QUANTITY FAILSDATE CODE
P1-P3P4-P4

DS1961K#

Mfr. #:
Buy DS1961K#
Manufacturer:
Maxim Integrated
Description:
Memory IC Development Tools DS1961S Eval Kit
Lifecycle:
New from this manufacturer.
Delivery:
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