NLV14044BDR2G Datasheet MC14044BDR2G, MC14044BDG, MC14043BDG | P4-P6

MC14043B, MC14044B

http://onsemi.com

4

SWITCHING CHARACTERISTICS (Note 5) (C

L

= 50 pF, T

A

= 25_C)

Characteristic Symbol

V

DD

Vdc

Min

Typ

(Note 6)

Max Unit

Output Rise Time

t

TLH

= (1.35 ns/pF) C

L

+ 32.5 ns

t

TLH

= (0.60 ns/pF) C

L

+ 20 ns

t

TLH

= (0.40 ns/pF) C

L

+ 20 ns

t

TLH

5.0

10

15

−

100

50

40

200

100

80

ns

Output Fall Time

t

THL

= (1.35 ns/pF) C

L

+ 32.5 ns

t

THL

= (0.60 ns/pF) C

L

+ 20 ns

t

THL

= (0.40 ns/pF) C

L

+ 20 ns

t

THL

5.0

10

15

−

100

50

40

200

100

80

ns

Propagation Delay Time

t

PLH

= (0.90 ns/pF) C

L

+ 130 ns

t

PLH

= (0.36 ns/pF) C

L

+ 57 ns

t

PLH

= (0.26 ns/pF) C

L

+ 47 ns

t

PLH

5.0

10

15

−

175

75

60

350

175

120

ns

t

PHL

= (0.90 ns/pF) C

L

+ 130 ns

t

PHL

= (0.90 ns/pF) C

L

+ 57 ns

t

PHL

= (0.26 ns/pF) C

L

+ 47 ns

t

PHL

5.0

10

15

−

175

75

60

350

175

120

ns

Set, Set Pulse Width t

W

5.0

10

15

200

100

70

80

40

30

−

ns

Reset, Reset Pulse Width t

W

5.0

10

15

200

100

70

80

40

30

−

ns

Three−State Enable/Disable Delay t

PLZ

,

t

PHZ

,

t

PZL

,

t

PZH

5.0

10

15

−

150

80

55

300

160

110

ns

5. The formulas given are for the typical characteristics only at 25_C.

6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

AC WAVEFORMS

MC14043B MC14044B

20 ns 20 ns

90%

10%

RESET

SET

Q

t

PHL

t

PLH

20 ns 20 ns

50%

90%

50%

10%

t

THL

t

TLH

90%

50%

10%

V

DD

V

SS

V

DD

V

SS

V

OH

V

OL

RESET

SET

Q

20 ns 20 ns

90%

10%

50%

20 ns 20 ns

90%

10%

50%

t

TLH

t

THL

50%

10%

90%

t

PLH

t

PHL

V

DD

V

SS

V

DD

V

SS

V

OH

V

OL

MC14043B, MC14044B

http://onsemi.com

5

THREE−STATE ENABLE/DISABLE DELAYS

Set, Reset, Enable, and Switch Conditions for 3−State Tests

Test Enable S1 S2 Q

MC14043B MC14044B

S R S R

t

PZH

Open Closed A V

DD

V

SS

V

SS

V

DD

t

PZL

Closed Open B V

SS

V

DD

V

DD

V

SS

t

PHZ

Open Closed A V

DD

V

SS

V

SS

V

DD

t

PLZ

Closed Open B V

SS

V

DD

V

DD

V

SS

ENABLE

Q

A

Q

B

50%

t

PZH

10%

t

PZL

t

PHZ

t

PLZ

10%

90%

V

DD

V

SS

V

DD

V

OL

V

OH

V

SS

ORDERING INFORMATION

Device Package Shipping

†

MC14043BDG SOIC−16

(Pb−Free)

48 Units / Rail

NLV14043BDG* SOIC−16

(Pb−Free)

48 Units / Rail

MC14043BDR2G SOIC−16

(Pb−Free)

2500 Units / Tape & Reel

NLV14043BDR2G* SOIC−16

(Pb−Free)

2500 Units / Tape & Reel

MC14043BFELG SOEIAJ−16

(Pb−Free)

2000 Units / Tape & Reel

MC14044BDG SOIC−16

(Pb−Free)

48 Units / Rail

NLV14044BDG* SOIC−16

(Pb−Free)

48 Units / Rail

MC14044BDR2G SOIC−16

(Pb−Free)

2500 Units / Tape & Reel

NLV14044BDR2G* SOIC−16

(Pb−Free)

2500 Units / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

TO

OUTPUT

UNDER

TEST

V

DD

S1

S2

1 k

C

L

50 pF

V

SS

MC14043B, MC14044B

http://onsemi.com

6

PACKAGE DIMENSIONS

SOIC−16

D SUFFIX

CASE 751B−05

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

18

16 9

SEATING

PLANE

F

J

M

R

X 45

_

G

8 PLP

−B−

−A−

M

0.25 (0.010) B

S

−T−

D

K

C

16 PL

S

B

M

0.25 (0.010) A

S

T

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 9.80 10.00 0.386 0.393

B 3.80 4.00 0.150 0.157

C 1.35 1.75 0.054 0.068

D 0.35 0.49 0.014 0.019

F 0.40 1.25 0.016 0.049

G 1.27 BSC 0.050 BSC

J 0.19 0.25 0.008 0.009

K 0.10 0.25 0.004 0.009

M 0 7 0 7

P 5.80 6.20 0.229 0.244

R 0.25 0.50 0.010 0.019

____

6.40

16X

0.58

16X

1.12

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

16

89

8X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

NLV14044BDR2G

NLV14044BDR2G

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