Data Sheet ADG333A
Rev. B | Page 13 of 13
20 11
10
1
7.50
7.20
6.90
8.20
7.80
7.40
5.60
5.30
5.00
COPLANARITY
0.10
0.05 MIN
1.85
1.75
1.65
0.65
BSC
0.25
0.09
0.95
0.75
0.55
8°
4°
0°
2.00 MAX
0.38
0.22
SEATING
PLANE
PIN 1
COMPLIANT TO JEDEC STANDARDS MO-150AE
Figure 24. 20-Lead Shrink Small Outline Package [SSOP]
(RS-20)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range Package Description Package Option
20-Lead Plastic Dual In-Line Package [PDIP]
20-Lead Standard Small Outline Package [SOIC_W]
ADG333ABR-REEL −40°C to +85°C
20-Lead Standard Small Outline Package [SOIC_W]
RW-20
ADG333ABRZ −40°C to +85°C
20-Lead Standard Small Outline Package [SOIC_W]
RW-20
ADG333ABRZ-REEL −40°C to +85°C
20-Lead Standard Small Outline Package [SOIC_W]
RW-20
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
ADG333ABRSZ-REEL −40°C to +85°C
20-Lead Shrink Small Outline Package [SSOP]
RS-20
1
Z = RoHS Compliant Part.
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D01212-0-6/16(B)