NB7L585RMNG

© Semiconductor Components Industries, LLC, 2009
October, 2009 Rev. 0
1
Publication Order Number:
NB7L585R/D
NB7L585R
2.5V/3.3V, 7GHz/10Gbps
Differential 2:1 Mux Input to
1:6 RSECL Clock/Data
Fanout Buffer / Translator
MultiLevel Inputs w/ Internal
Termination
Description
The NB7L585R is a differential 1:6 RSECL Clock/Data distribution
chip featuring a 2:1 Clock/Data input multiplexer with an input select
pin. The INx/INx
inputs incorporate internal 50 W termination
resistors and will accept LVPECL, CML, or LVDS logic levels.
The NB7L585R produces six identical output copies of Clock or
Data operating up to 7 GHz or 10 Gb/s, respectively. As such,
NB7L585R is ideal for SONET, GigE, Fiber Channel, Backplane and
other Clock/Data distribution applications.
The NB7L585R is powered with either 2.5 V or 3.3 V supply and is
offered in a low profile 5mm x 5mm 32pin QFN package.
Application notes, models, and support documentation are available
at www.onsemi.com.
The NB7L585R is a member of the GigaComm family of high
performance clock products.
Features
Maximum Input Data Rate > 10 Gb/s Typical
Data Dependent Jitter < 10 ps
Maximum Input Clock Frequency > 7 GHz Typical
Random Clock Jitter < 0.8 ps RMS
Low Skew 1:6 RSECL Outputs, 20 ps max
2:1 MultiLevel Mux Inputs
160 ps Typical Propagation Delay
40 ps Typical Rise and Fall Times
Differential RSECL Outputs, 400 mV peaktopeak, typical
Operating Range: V
CC
= 2.375 V to 3.6 V with GND = 0 V
Internal 50 W Input Termination Resistors
VREFAC Reference Output
QFN32 Package, 5mm x 5mm
40ºC to +85ºC Ambient Operating Temperature
These Devices are PbFree and are RoHS Compliant
QFN32
MN SUFFIX
CASE 488AM
See detailed ordering and shipping information on page 8 of
this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAM
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32
1
NB7L
585R
AWLYYWWG
G
1
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = PbFree Package
(Note: Microdot may be in either location)
50 W
50 W
IN1
VT1
IN1
50 W
50 W
IN0
VT0
IN0
Figure 1. Simplified Block Diagram
0
1
VREFAC1
VREFAC0
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
Q5
Q5
V
CC
GND
+
SEL
NB7L585R
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2
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
910111213 161514
32 31 30 29 28 252627
IN0
VT0
VREFAC0
IN0
IN1
VT1
VREFAC1
IN1
GND
VCC
Q2
Q3
VCC
GND
Q2
GND
VCC
Q5
Q4
VCC
Q5
SEL
VCC
Q0
Q1
VCC
Q0
Exposed
Pad (EP)
GND
Q1
Q3
Q4
NC
Figure 2. Pinout: QFN32 (Top View)
NB7L585R
Table 1. INPUT SELECT FUNCTION TABLE
SEL* CLK Input Selected
0 IN0
1 IN1
*Defaults HIGH when left open.
Table 2. PIN DESCRIPTION
Pin Number Pin Name I/O Pin Description
1,4
5,8
IN0, IN0
IN1, IN1
LVPECL, CML,
LVDS Input
Noninverted, Inverted, Differential Data Inputs internally biased to V
CC
/2
2,6 VT0, VT1
Internal 100 W Centertapped Termination Pin for IN0 / IN0 and IN1 / IN1
31 SEL LVTTL/LVCMOS
Input
Input Select pin; LOW for IN0 Inputs, HIGH for IN1 Inputs; defaults HIGH when left
open
10 NC No Connect
11, 16, 18
23, 25, 30
V
CC
Positive Supply Voltage. All V
CC
pins must be connected to the positive power supply
for correct DC and AC operation.
29, 28
27, 26
22, 21
20, 19
15, 14
13, 12
Q0, Q0
Q1, Q1
Q2,Q2
Q3, Q3
Q4, Q4
Q5, Q5
RSECL Output Noninverted, Inverted Differential Outputs Note 1.
9, 17, 24, 32 GND Negative Supply Voltage, connected to Ground
3
7
VREFAC0
VREFAC1
Output Voltage Reference for CapacitorCoupled Inputs
EP The Exposed Pad (EP) on the QFN32 package bottom is thermally connected to the
die for improved heat transfer out of package. The exposed pad must be attached to a
heatsinking conduit. The pad is electrically connected to the die, and must be elec-
trically and thermally connected to GND on the PC board.
1. In the differential configuration when the input termination pins (VT0, VT1) are connected to a common termination voltage or left open, and
if no signal is applied on INn/INn
input, then the device will be susceptible to selfoscillation.
2. All V
CC
and GND pins must be externally connected to a power supply for proper operation.
NB7L585R
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3
Table 3. ATTRIBUTES
Characteristics Value
ESD Protection Human Body Model
Machine Model
> 2 kV
> 200 V
R
PU
SEL Input Pullup Resistor
37.5 kW
Moisture Sensitivity (Note 3) QFN32 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 303
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Positive Power Supply GND = 0 V +4.0 V
V
IO
Input/Output Voltage GND = 0 V 0.5 to V
CC
+0.5 V
V
INPP
Differential Input Voltage |IN IN| 1.89 V
I
IN
Input Current Through R
T
(50 W Resistor)
$40 mA
I
out
Output Current Continuous
Surge
50
100
mA
I
VREFAC
VREFAC Sink or Source Current $1.5 mA
T
A
Operating Temperature Range 40 to +85 °C
T
stg
Storage Temperature Range 65 to +150 °C
q
JA
Thermal Resistance (JunctiontoAmbient) (Note 4) 0 lfpm
500 lfpm
QFN32
QFN32
31
27
°C/W
q
JC
Thermal Resistance (JunctiontoCase) (Note 4) QFN32 12 °C/W
T
sol
Wave Solder 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard multilayer board 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.

NB7L585RMNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Drivers & Distribution 2.5/3.3V 2:1 DIFF MUX
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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