AOT11N70

AOT11N70/AOTF11N70
700V,11A N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 11A
R
DS(ON)
(at V
GS
=10V) < 0.87
100% UIS Tested
100% R
g
Tested
For Halogen Free add "L" suffix to part number:
AOT11N70L & AOTF11N70L
Symbol
V
DS
V
GS
I
DM
I
AR
E
AR
E
AS
Peak diode recovery dv/dt dv/dt
T
J
, T
STG
T
L
Symbol
R
θ
JA
R
θCS
R
θJC
* Drain current limited by maximum junction temperature.
A
W
W/
o
C
°C
mJ
V/ns
°C
Maximum Case-to-sink
A
Maximum Junction-to-Case
mJ
°C/W
°C/W
Derate above 25
o
C
Parameter AOT11N70 AOTF11N70
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
700
I
D
5
50.0271
7.2
11*
7.2*
The AOT11N70 & AOTF11N70 have been fabricated
using an advanced high voltage MOSFET process that is
designed to deliver high levels of performance and
robustness in popular AC-DC applications.
By providing low R
DS(on)
, C
iss
and C
rss
along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
V
UnitsParameter
Absolute Maximum Ratings T
A
AOT11N70 AOTF11N70
800V@150
Drain-Source Voltage
V±30Gate-Source Voltage
T
C
=100°C
A
43Pulsed Drain Current
C
Continuous Drain
Current
T
C
=25°C
11
Avalanche Current
C
120
Single plused avalanche energy
G
240
4
Repetitive avalanche energy
C
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
A,D
Power Dissipation
B
P
D
T
C
=25°C
Thermal Characteristics
300
-55 to 150
2.1 0.4
0.46
--
Units
°C/W65
0.5
65
2.5
Top View
TO-220F
TO-220
G
D
S
G
D
S
G
D
S
Rev 0: March 2010 www.aosmd.com Page 1 of 6
AOT11N70/AOTF11N70
Symbol Min Typ Max Units
700
800
BV
DSS
/
TJ
0.8
V/
o
C
1
10
I
GSS
Gate-Body leakage current
±100
nΑ
V
GS(th)
Gate Threshold Voltage
3 3.8 4.5 V
R
DS(ON)
0.72 0.87
g
FS
17 S
V
SD
0.72 1 V
I
S
Maximum Body-Diode Continuous Current 11 A
I
SM
43 A
C
iss
1430 1793 2150 pF
C
oss
116 146 190 pF
C
rss
8.4 10.5 15 pF
R
g
1.8 3.6 5.4
Q
g
30 37.5 45 nC
Q
gs
7.8 10 12 nC
Q
gd
12 15 22 nC
t
D(on)
42 ns
t
r
74 ns
t
D(off)
103 ns
t
f
62 ns
t
rr
320 400
480 ns
Q
rr
7.2 9
11
µC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Time
Static Drain-Source On-Resistance
V
GS
=10V, I
D
=5.5A
Reverse Transfer Capacitance
I
F
=11A,dI/dt=100A/µs,V
DS
=100V
V
GS
=0V, V
DS
=25V, f=1MHz
SWITCHING PARAMETERS
I
S
=1A,V
GS
=0V
V
DS
=40V, I
D
=5.5A
Forward Transconductance
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
I
DSS
Zero Gate Voltage Drain Current
V
DS
=700V, V
GS
=0V
Diode Forward Voltage
V
DS
=5V
I
D
=250µA
V
DS
=560V, T
J
=125°C
Turn-Off DelayTime
V
GS
=10V, V
DS
=350V, I
D
=11A,
R
G
=25
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Turn-Off Fall Time
Total Gate Charge
V
GS
=10V, V
DS
=560V, I
D
=11A
Gate Source Charge
Gate Drain Charge
BV
DSS
Body Diode Reverse Recovery Charge
I
F
=11A,dI/dt=100A/µs,V
DS
=100V
Maximum Body-Diode Pulsed Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
µA
V
DS
=0V, V
GS
30V
V
Drain-Source Breakdown Voltage
I
D
=250µA, V
GS
=0V, T
J
=25°C
I
D
=250µA, V
GS
=0V, T
J
=150°C
Zero Gate Voltage Drain Current ID=250µA, VGS=0V
A. The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C, Ratings are based on low frequency and duty cycles to keep initial T
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse ratin g.
G. L=30mH, I
AS
=4A, V
DD
=150V, R
G
=25, Starting T
J
=25°C
Rev 0: March 2010 www.aosmd.com Page 2 of 6
AOT11N70/AOTF11N70
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
40
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
I
S
(A)
25°C
125°C
0
5
10
15
20
0 5 10 15 20 25 30
V
DS
(Volts)
Fig 1: On-Region Characteristics
I
D
(A)
V
GS
=5.5V
6V
10V 6.5V
0.1
1
10
100
2 4 6 8 10
V
GS
(Volts)
Figure 2: Transfer Characteristics
I
D
(A)
-55°C
V
DS
=40V
25°C
125°C
0.0
0.5
1.0
1.5
2.0
0 5 10 15 20 25
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
R
DS(ON)
(
)
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
Normalized On-Resistance
V
GS
=10V
I
D
=5.5A
0.8
0.9
1
1.1
1.2
-100 -50 0 50 100 150 200
T
J
C)
Figure 5:Break Down vs. Junction Temparature
BV
DSS
(Normalized)
Rev 0: March 2010 www.aosmd.com Page 3 of 6

AOT11N70

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 700V 11A TO220
Lifecycle:
New from this manufacturer.
Delivery:
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