NVTFS5824NLTWG

© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 0
1 Publication Order Number:
NVTFS5824NL/D
NVTFS5824NL
Power MOSFET
60 V, 20.5 mW, 37 A, Single N−Channel
Features
Small Footprint (3.3 x 3.3 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
NVTFS5824NLWF − Wettable Flanks Product
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
60 V
Gate−to−Source Voltage V
GS
±20 V
Continuous Drain Cur
-
rent R
Y
J−mb
(Notes 1,
2, 3, 4)
Steady
State
T
mb
= 25°C
I
D
37
A
T
mb
= 100°C 26
Power Dissipation
R
Y
J−mb
(Notes 1, 2, 3
)
T
mb
= 25°C
P
D
57
W
T
mb
= 100°C 28
Continuous Drain Cur
-
rent R
q
JA
(Notes 1 &
3, 4)
Steady
State
T
A
= 25°C
I
D
7.6
A
T
A
= 100°C 5.4
Power Dissipation
R
q
JA
(Notes 1, 3)
T
A
= 25°C
P
D
3.2
W
T
A
= 100°C 1.6
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
127 A
Operating Junction and Storage Temperature T
J
, T
stg
−55 to
+175
°C
Source Current (Body Diode) I
S
18 A
Single Pulse Drain−to−Source Avalanche
Energy (T
J
= 25°C, V
DD
= 24 V, V
GS
= 10 V,
I
L(pk)
= 20 A, L = 0.1 mH, R
G
= 25 W)
E
AS
20 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol Value Unit
Junction−to−Case − Steady State (Note 3)
R
q
JC
2.6
°C/W
Junction−to−Ambient − Steady State (Note 3)
R
q
JA
47
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surface−mounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
4. Continuous DC current rating. Maximum current for pulses as long as 1
second is higher but is dependent on pulse duration and duty cycle.
www.onsemi.com
V
(BR)DSS
R
DS(on)
MAX I
D
MAX
60 V
20.5 mW @ 10 V
37 A
WDFN8
(m8FL)
CASE 511AB
MARKING DIAGRAM
27 mW @ 4.5 V
(Note: Microdot may be in either location)
1
XXXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
1
XXXX
AYWWG
G
D
D
D
D
S
S
S
G
N−Channel
D (5 − 8)
S (1, 2, 3)
G (4)
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
NVTFS5824NL
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
60 V
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 60 V
T
J
= 25°C 1.0 mA
T
J
= 125°C 10
Gate−to−Source Leakage Current I
GSS
V
DS
= 0 V, V
GS
= "20 V "100 nA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.5 2.5 V
Drain−to−Source On Resistance R
DS(on)
V
GS
= 10 V, I
D
= 10 A 17.5 20.5 mW
V
GS
= 4.5 V, I
D
= 10 A 23.5 27
Forward Transconductance g
FS
V
DS
= 15 V, I
D
= 5 A 8 S
CHARGES AND CAPACITANCES
Input Capacitance C
iss
V
GS
= 0 V, f = 1.0 MHz,
V
DS
= 25 V
850
pF
Output Capacitance C
oss
85
Reverse Transfer Capacitance C
rss
50
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 48 V, I
D
= 10 A
8.3 nC
Threshold Gate Charge Q
G(TH)
1
nC
Gate−to−Source Charge Q
GS
3
Gate−to−Drain Charge Q
GD
4
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 48 V, I
D
= 10 A 16
nC
SWITCHING CHARACTERISTICS (Note 6)
Turn−On Delay Time
t
d(on)
V
GS
= 4.5 V, V
DS
= 48 V,
I
D
= 10 A
9
ns
Rise Time t
r
29
Turn−Off Delay Time t
d(off)
14
Fall Time t
f
21
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 10 A
T
J
= 25°C 0.8 1.2
V
T
J
= 125°C 0.7
Reverse Recovery Time t
RR
V
GS
= 0 V, dl
S
/dt = 100 A/ms,
I
S
= 10 A
18
ns
Charge Time t
a
14
Discharge Time t
b
4
Reverse Recovery Charge Q
RR
17 nC
5. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.
6. Switching characteristics are independent of operating junction temperatures.
NVTFS5824NL
www.onsemi.com
3
TYPICAL CHARACTERISTICS
0
10
20
30
40
50
60
01234
Figure 1. On−Region Characteristics
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
10 V
3.4 V
3.8 V
3.6 V
3.0 V
3.2 V
4.0 V
T
J
= 25°C
5
V
GS
= 4.5 V
2.8 V
0
10
20
30
40
50
12345
V
DS
10 V
T
J
= 25°C
T
J
= −55°C
T
J
= 125°C
Figure 2. Transfer Characteristics
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
0.010
0.020
0.030
0.040
0.050
246810
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (W)
I
D
= 10 A
T
J
= 25°C
0.010
0.020
0.030
0.040
5 10152025303540
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (W)
V
GS
= 4.5 V
T
J
= 25°C
V
GS
= 10 V
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
2.20
2.40
−50 −25 0 25 50 75 100 125 150 175
Figure 5. On−Resistance Variation with
Temperature
T
J
, JUNCTION TEMPERATURE (°C)
R
DS(on)
, DRAIN−TO−SOURCE
RESISTANCE (NORMALIZED)
V
GS
= 10 V
I
D
= 10 A
100
1000
10000
100000
10 20 30 40 50 60
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
I
DSS
, LEAKAGE (nA)
T
J
= 125°C
T
J
= 150°C
V
GS
= 0 V

NVTFS5824NLTWG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET U8FL 60V 20A 25
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union