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Document Number: 20035
130 Revision: 04-Jun-12
D/CRCW e3
Vishay
Standard Thick Film Chip Resistors
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TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
SIZE 0402 to 2512
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
Stability for product types:
D/CRCW e3 1 to 10 M
4.5 - Resistance - ± 1 % ± 5 %
4.7 - Voltage proof U = 1.4 x U
ins
; 60 s No flashover or breakdown
4.13 - Short time overload
U = 2.5 x
2 x U
max.
;
duration: Acc. to style
±0.25 % R + 0.05)±0.5 % R + 0.05)
4.17.2 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) C
(3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 -
Temperature
coefficient
(20/- 55/20) C and
(20/125/20) C
± 100 ppm/K ± 200 ppm/K
4.32 21 (Uu
3
)
Shear
(adhesion)
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
No visible damage
4.33 21 (Uu
1
) Substrate bending
Depth 2 mm;
3 times
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 )
4.19 14 (Na)
Rapid change of
temperature
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
1000 cycles ± (1 % R + 0.05 )± (1 % R + 0.05 )
4.23 - Climatic sequence: -
± (1 % R + 0.05 )± (2 % R + 0.1 )
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic
55 °C; 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold - 55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic
55 °C; 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U =
4.25.1 -
Endurance
at 70 °C
U = U
max.
;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (1 % R + 0.05 )± (2 % R + 0.1 )
70 °C; 8000 h ± (2 % R + 0.1 )± (4 % R + 0.1 )
