MC33030
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4
ELECTRICAL CHARACTERISTICS (continued) (V
CC
= 14 V, T
A
= 25°C, unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
WINDOW DETECTOR
Input Hysteresis Voltage (V
1
− V
4
, V
2
− V
3
, Figure 18) V
H
25 35 45 mV
Input Dead Zone Range (V
2
− V
4
, Figure 18) V
IDZ
166 210 254 mV
Input OffsetVoltage (⎢[V
2
− V
Pin
2
] − [V
Pin
2
− V
4
]⎟ Figure 18) V
IO
− 25 − mV
Input Functional Common−Mode Range (Note 3)
Upper Threshold
Lower Threshold
V
IH
V
IL
−
−
(V
CC
− 1.05)
0.24
−
−
V
Reference Input Self Centering Voltage
Pins 1 and 2 Open
V
RSC
− (1/2 V
CC
) − V
Window Detector Propagation Delay
Comparator Input, Pin 3, to Drive Outputs
V
ID
= 0.5 V, R
L(DRV)
= 390 W
t
p(IN/DRV)
− 2.0 −
ms
OVERCURRENT MONITOR
Overcurrent Reference Resistor Voltage (Pin 15) R
OC
3.9 4.3 4.7 V
Delay Pin Source Current
V
DLY
= 0 V, R
OC
= 27 k, I
DRV
= 0 mA
I
DLY(source)
− 5.5 6.9
mA
Delay Pin Sink Current (R
OC
= 27 k, I
DRV
= 0 mA)
V
DLY
= 5.0 V
V
DLY
= 8.3 V
V
DLY
= 14 V
I
DLY(sink)
−
−
−
0.1
0.7
16.5
−
−
−
mA
Delay Pin Voltage, Low State (I
DLY
= 0 mA) V
OL(DLY)
− 0.3 0.4 V
Overcurrent Shutdown Threshold
V
CC
= 14 V
V
CC
= 8.0 V
V
th(OC)
6.8
5.5
7.5
6.0
8.2
6.5
V
Overcurrent Shutdown Propagation Delay
Delay Capacitor Input, Pin 16, to Drive Outputs, V
ID
= 0.5 V
t
p(DLY/DRV)
− 1.8 −
ms
POWER H−SWITCH
Drive−Output Saturation (− 40°C p T
A
p+ 85°C, Note 4)
High−State (I
source
= 100 mA)
Low−State (I
sink
= 100 mA)
V
OH(DRV)
V
OL(DRV)
(V
CC
− 2)
−
(V
CC
− 0.85)
0.12
−
1.0
V
Drive−Output Voltage Switching Time (C
L
= 15 pF)
Rise Time
Fall Time
t
r
t
f
−
−
200
200
−
−
ns
Brake Diode Forward Voltage Drop (I
F
= 200 mA, Note 4) V
F
− 1.04 2.5 V
TOTAL DEVICE
Standby Supply Current I
CC
− 14 25 mA
Overvoltage Shutdown Threshold (− 40°C p T
A
p + 85°C) V
th(OV)
16.5 18 20.5 V
Overvoltage Shutdown Hysteresis (Device “off” to “on”) V
H(OV)
0.3 0.6 1.0 V
Operating Voltage Lower Threshold (− 40°C p T
A
p + 85°C) V
CC
− 7.5 8.0 V
3. The upper or lower hysteresis will be lost when operating the Input, Pin 3, close to the respective rail. Refer to Figure 4.
4. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible.
