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MAX3202EETT+T

P1-P3P4-P6P7-P9
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim's website at www.maxim-ic.com.
General Description
The MAX3202E/MAX3203E/MAX3204E/MAX3206E are
low-capacitance ±15kV ESD-protection diode arrays
designed to protect sensitive electronics attached to
communication lines. Each channel consists of a pair of
diodes that steer ESD current pulses to V
CC
or GND.
The MAX3202E/MAX3203E/MAX3204E/MAX3206E pro-
tect against ESD pulses up to ±15kV Human Body
Model, ±8kV Contact Discharge, and ±15kV Air-Gap
Discharge, as specified in IEC 61000-4-2. These
devices have a 5pF capacitance per channel, making
them ideal for use on high-speed data I/O interfaces.
The MAX3202E is a two-channel device intended for USB
and USB 2.0 applications. The MAX3203E is a triple-ESD
structure intended for USB On-the-Go (OTG) and video
applications. The MAX3204E is a quad-ESD structure
designed for Ethernet and FireWire
®
applications, and
the MAX3206E is a six-channel device designed for
cell phone connectors and SVGA video connections.
All devices are available in tiny 4-bump (1.05mm x
1.05mm) WLP, 6-bump (1.05mm x 1.57mm) WLP,
9-bump (1.52mm x 1.52mm) WLP, 6-pin (3mm x 3mm)
TDFN, and 12-pin (4mm x 4mm) TQFN packages and
are specified for -40°C to +85°C operation.
Applications
USB Video
USB 2.0 Cell Phones
Ethernet SVGA Video Connections
FireWire
Features
♦ High-Speed Data Line ESD Protection
±15kV—Human Body Model
±8kV—IEC 61000-4-2, Contact Discharge
±15kV—IEC 61000-4-2, Air-Gap Discharge
♦ Tiny WLP Package Available
♦ Low 5pF Input Capacitance
♦ Low 1nA (max) Leakage Current
♦ Low 1nA Supply Current
♦ +0.9V to +5.5V Supply Voltage Range
♦ 2-, 3-, 4-, or 6-Channel Devices Available
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
19-2739; Rev 5; 6/11
*
EP = Exposed pad.
Note: All devices operate over -40°C to +85°C temperature
range.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
PART PIN-PACKAGE TOP MARK
MAX3202EEWS+T
4 WLP +AA
MAX3202EETT+T
6 TDFN-EP* +ADQ
MAX3203EEEWT+T
6 WLP +BG
MAX3203EETT+T 6 TDFN-EP* +ADO
MAX3204EEWT+T 6 WLP +AL
MAX3204EETT+T 6 TDFN-EP* +ADP
MAX3206EEWL+T 9 WLP +AQ
MAX3206EETC+ 12 TQFN-EP* +AACA
Selector Guide
PART
ESD-PROTECTED
I/O PORTS
MAX3202EEWS+T
2
MAX3202EETT-T 2
MAX3203EEWT+T 3
MAX3203EETT-T 3
MAX3204EEBT-T 4
MAX3204EETT-T 4
MAX3206EEBL-T 6
MAX3206EETC 6
Pin Configurations appear at end of data sheet.
FireWire is a registered trademark of Apple Computer, Inc.
MAX3202E
MAX3204E
MAX3206E
MAX3208E
PROTECTED
CIRCUIT
0.1µF
0.1µF
I/0_I/0
V
CC
V
CC
Typical Operating Circuit
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= +5V ±5%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5V and T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 2: Limits over temperature are guaranteed by design, not production tested.
Note 3: Idealized clamp voltages (L1 = L2 = L3 = 0) (Figure 1 ); see the
Applications Information
section for more information.
Note 4: Guaranteed by design. Not production tested.
V
CC
to GND...........................................................-0.3V to +7.0V
I/O_ to GND................................................-0.3V to (V
CC
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
2 × 2 WLP (derate 11.5mW/°C above +70°C)...............920mW
3 × 2 WLP (derate 12.3mW/°C above +70°C)...............984mW
3 × 3 WLP (derate 14.1mW/°C above +70°C).............1128mW
6-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
12-Pin TQFN (derate 16.9mW/°C above +70°C) ........1349mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature .....................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
0.9 5.5 V
Supply Current I
CC
1 100 nA
Diode Forward Voltage V
F
I
F
= 10mA 0.65 0.95 V
Positive transients V
CC
+ 25
T
A
= +25°C, ±15kV
Human Body Model,
I
F
= 10A
Negative transients -25
Positive transients V
CC
+ 60
T
A
= +25°C, ±8kV
Contact Discharge
(IEC 61000-4-2), I
F
= 24A
Negative transients -60
Positive transients V
CC
+ 100
Channel Clamp Voltage
(Note 3)
V
C
T
A
= +25°C, ±15kV
Air-Gap Discharge
(IEC 61000-4-2), I
F
= 45A
Negative transients -100
V
Channel Leakage Current T
A
= 0°C to +50°C (Note 4) -1 +1 nA
Channel Input Capacitance V
CC
= 5V, bias of V
CC
/2 5 7 pF
ESD PROTECTION
Human Body Model ±15 kV
IEC 61000-4-2
Contact Discharge
±8 kV
IEC 61000-4-2
Air-Gap Discharge
±15 kV
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
4 WLP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............87°C/W
6 WLP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............84°C/W
9 WLP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............71°C/W
6 TDFN
Junction-to-Ambient Thermal Resistance (θ
JA
)....................42°C/W
Junction-to-Case Thermal Resistance (θ
JC
)...........................9°C/W
12 TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
)....................41°C/W
Junction-to-Case Thermal Resistance (θ
JC
)...........................6°C/W
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
_______________________________________________________________________________________
3
Typical Operating Characteristics
(V
CC
= +5V, T
A
= +25°C, unless otherwise noted.)
Pin/Bump Description
PIN/BUMP
MAX3202E MAX3203E MAX3204E MAX3206E
WLP
TDFN-
EP
WLP
TDFN-
EP
WLP
TDFN-
EP
WLP
TQFN-
EP
NAME FUNCTION
A1, B2 3, 6
A1,
A2, B3
1, 2, 4
A1, A2,
B2, B3
1, 2, 4,
5
A1, A3,
B1, B3,
C1, C3
1, 2, 3,
7, 8, 9
I/O_ ESD-Protected Channel
A2 4 B1 3 B1 3 A2 5 GND Ground
B1 1 A3 6 A3 6 C2 11 V
CC
Power-Supply Input. Bypass V
CC
to
GND with a 0.1µF ceramic capacitor.
— 2, 5 — 5 — — —
4, 6,
10, 12
N.C.
No Connection. Not internally
connected.
— — — — — — — — EP
Exposed Pad. Connect to GND. Only
for TDFN and TQFN packages.
0.30
0.70
0.50
1.10
0.90
1.30
1.50
CLAMP VOLTAGE vs. DC CURRENT
MAX3202E toc01
DC CURRENT (mA)
CLAMP VOLTAGE (V)
30 70 9050 110 130 150
1
10
100
1000
25 35
45
55
65
75 85
LEAKAGE CURRENT vs. TEMPERATURE
MAX3202E toc02
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)
LEAKAGE CURRENT PER CHANNEL
2
4
8
6
10
12
021345
INPUT CAPACITANCE vs. INPUT VOLTAGE
MAX3202E toc03
INPUT VOLTAGE (V)
INPUT CAPACITANCE (pF)
V
CC
= 3.3V
V
CC
= 5.0V
P1-P3P4-P6P7-P9

MAX3202EETT+T

Mfr. #:
Buy MAX3202EETT+T
Manufacturer:
Maxim Integrated
Description:
TVS Diodes / ESD Suppressors 2Ch ESD Protection Array
Lifecycle:
New from this manufacturer.
Delivery:
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