Data Sheet ADG1411/ADG1412/ADG1413
Rev. C | Page 13 of 16
TEST CIRCUITS
Sx Dx
V
S
I
S
V1
R
ON
= V1/I
S
06815-020
Figure 23. On Resistance
Sx Dx
V
S
A A
V
D
I
S
(OFF) I
D
(OFF)
0
6815-021
Figure 24. Off Leakage
Sx Dx
A
V
D
I
D
(ON)
NIC
NIC = NO INTERNAL CONNECTION.
06815-022
Figure 25. On Leakage
V
OUT
50
NETWORK
ANALYZER
R
L
50
INx
V
IN
Sx
Dx
50
OFF ISOLATION = 20 log
V
OUT
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
06815-026
Figure 26. Off Isolation
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
V
OUT
GND
S1
Dx
S2
V
OUT
NETWORK
ANALYZER
R
L
50
R
L
50
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
06815-027
Figure 27. Channel-to-Channel Crosstalk
V
OUT
50
NETWORK
ANALYZER
R
L
50
INx
V
IN
Sx
Dx
INSERTION LOSS = 20 log
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
0
6815-028
Figure 28. Bandwidth
ADG1411/ADG1412/ADG1413 Data Sheet
Rev. C | Page 14 of 16
V
OUT
R
S
AUDIO PRECISION
R
L
110
INx
V
IN
Sx
Dx
V
S
V p-p
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
06815-029
Figure 29. THD + Noise
V
S
INx
Sx
Dx
GND
R
L
300Ω
C
L
35pF
V
OUT
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
ADG1412
ADG1411
V
IN
V
IN
V
OUT
t
ON
t
OFF
50% 50%
90% 90%
50% 50%
06815-023
Figure 30. Switching Times
V
S2
IN1,
IN2
S2
D2
V
S1
S1 D1
GND
R
L
300Ω
C
L
35pF
V
OUT2
V
OUT1
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
V
IN
V
OUT1
V
OUT2
ADG1413
t
D
t
D
50% 50%
90%
90%
90%
90%
0V
0V
0V
R
L
300Ω
C
L
35pF
06815-024
Figure 31. Break-Before-Make Time Delay
INx
V
OUT
ADG1412
ADG1411
V
IN
V
IN
V
OUT
OFF
ΔV
OUT
ON
Q
INJ
= C
L
× ΔV
OUT
Sx
Dx
V
DD
V
SS
V
DD
V
SS
V
S
R
S
GND
C
L
1nF
06815-025
Figure 32. Charge Injection
Data Sheet ADG1411/ADG1412/ADG1413
Rev. C | Page 15 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 33. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
042709-A
1
0.65
BSC
BOTTOMVIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.50
0.40
0.30
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
2.60
2.50 SQ
2.40
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-26)
Dimensions shown in millimeters

ADG1412YCPZ-REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog Switch ICs 1.8 Ohm 250mA iCMOS Quad SPST
Lifecycle:
New from this manufacturer.
Delivery:
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