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BRHL2518T4R7MD

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▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_BR_reli_e-01
15. Damp heat
Specified Value ALL OF BR-SERIES
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The given sample is soldered to the board and then it is kept at the following conditions.
Temperature 60±2℃
Humidity 90～95%RH
Time 1000 hours.
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
16. Loading under damp heat
Specified Value ALL OF BR-SERIES
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The given sample is soldered to the board and then it is kept at the following conditions.
Temperature 60±2℃
Humidity 90～95％RH
Applied current Rated current
Time 1000hours.
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
17. Low temperature life test
Specified Value ALL OF BR-SERIES
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The given sample is soldered to the board and then it is kept at the following conditions.
Temperature －40±2℃
Duration 1000hours
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
18. High temperature life test
Specified Value ALL OF BR-SERIES
Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The given sample is soldered to the board and then it is kept at the following conditions.
Temperature 85±2℃
Duration 1000hours
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
19. Standard conditions
Specified Value ALL OF BR-SERIES
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide
correlation data, the test shall be condition of 20±2℃ of temperature, 65±5% relative
humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_BR_prec_e-01
Wound Chip power inductor （BR-series）
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating Ambient
The products are premised on the usage for the general equipments like the office supply equipment, the telecommunications systems, the
measuring equipment, the household equipment and so on.
Please ask to TAIYO YUDEN's sales person in advance, if you need to apply them to the equipments or the systems which might have any
influences for the human body, the property, like the traffic systems, the safety equipment, the aerospace systems, the nuclear control
systems, the medical equipment and soon.
2. PCB Design
Precautions
◆Land pattern design
1. Please refer to a recommended land pattern.
Technical
considerations
◆Land pattern design
Surface Mounting
1. The conditions of the picking and placing should be checked in advance.
2. The products are only for reflow soldering.
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive physical impact should not be imposed on the products for picking and placing onto the PC boards.
2. Mounting and soldering conditions should be checked in advance.
Technical
considerations
◆Adjustment of mounting machine
The products might be broken if too much stress is given for the picking and placing.
4. Soldering
Precautions
◆Reflow soldering
1. Please apply our recommended soldering conditions on the specification as much as possible.
2. The products are only for reflow soldering.
3. Please do not give any stress to a product until it returns in room temperature after reflow soldering.
◆Lead free soldering
1. Please check the adhesion, the solder temperature, the solderability and the shape of solder filet if the solder that is not in the
specification is used.
◆Recommended conditions for using a soldering iron (NR10050 Type)
Touch a soldering iron to the land pattern not to the product directly.
The temperature of a soldering iron is less than 350degC.
The soldering is for 3 seconds or less.
Technical
considerations
◆Reflow soldering
1. The product might break or might make the tombstoning, if the soldering conditions are too far from our recommended conditions.
5. Cleaning
Precautions
◆Cleaning conditions
1. Please don't wash by the ultra-sonic waves.
Technical
considerations
◆Cleaning conditions
1. Washing by the ultra-sonic waves might break the product.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_BR_prec_e-01
6. Handling
Precautions
◆Handling
1. Keep the product away from any magnets.
◆Cutting the PC boards
1. Please don't give any stress of the bending or the twisting for the cutting process of PC boards.
2. Please don't give any shock and stress to the products in transportation.
◆Mechanical considerations
1. Please don't give too much shock to the product.
2. Please don't give any shock and stress to the products in transportation.
◆The stress for picking and placing
1. Please don't give any shock into an exposed ferrite core.
◆Packing
1. Please don't pile the packing boxes up as much as possible.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Cutting the PC boards
1. Please don't give the bending stress or the twisting stress to the products because they might break in such cases.
◆Mechanical considerations
1. The mechanical shock might break the products.
2. The products might break depending on the handling in transportation.
◆Pick-up pressure
1. The electrical characteristics of the products might be shifted by too much physical shock and stress.
◆Packing
1. The products and the tape might break, if the packing boxes are piled up.
7. Storage conditions
Precautions
◆Storage
1. The packing boxes can be kept at the ambient which the temperature is from 0 to 40degC and the humidity is less than 70%.
2. The ambient temperature of less than 30degC is recommended not to get the tape and the solderability worse.
3. Please solder the products by a half year after they have been shipped.
Otherwise please use them after checking the solderability in advance.
Technical
considerations
◆Storage
1. The ambient of high temperature or high humidity might accelerate to make the solderability and the tape worse.
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BRHL2518T4R7MD

Mfr. #:
Buy BRHL2518T4R7MD
Manufacturer:
Taiyo Yuden
Description:
Fixed Inductors INDCTR BTM-SRF PWR WND 1007 4.7uH 20%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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