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SSM2804CBZ-R7

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SSM2804
Rev. 0 | Page 36 of 36
OUTLINE DIMENSIONS
A
B
C
D
E
0.660
0.600
0.540
3.000
2.960
2.920
12
3
456
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.270
0.240
0.210
0.390
0.360
0.330
0.360
0.320
0.280
2.00
REF
2.50 REF
BALL A1
IDENTIFIER
COPLANARITY
0.05
SEATING
PLANE
2.500
2.460
2.420
0.50
BALL PITCH
06-29-2010-B
Figure 40. 30-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-30-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
SSM2804CBZ-RL −40°C to +85°C 30-Ball Wafer Level Chip Scale Package [WLCSP] CB-30-4
SSM2804CBZ-R7 −40°C to +85°C 30-Ball Wafer Level Chip Scale Package [WLCSP] CB-30-4
EVAL-SSM2804Z Evaluation Board
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09960-0-7/11(0)
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SSM2804CBZ-R7

Mfr. #:
Buy SSM2804CBZ-R7
Manufacturer:
Analog Devices Inc.
Description:
Audio Amplifiers Audio Subsystem w/ Stereo ClassD Speakr
Lifecycle:
New from this manufacturer.
Delivery:
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